Here’s the page we think you wanted. See search results instead:

 

Contact an Expert

ADS Advanced EM in Germany (Münich)

Dear Customer,

Join us for 3 Learning Days in Munich next October 14, 15, 16!

 

For users of ADS with a thorough understanding of the layout environment and who have learned the fundamentals of Momentum simulations, meshing, Momentum RF and Momentum Microwave, and the common EM GUI for MoM and FEM (topics covered in the 3 day ADS Fundamentals class), this 3 day training class allows them to expand their knowledge into the advanced and powerful capabilities built on top of the basic infrastructure. These important capabilities, some of them unique amongst all the modern RF/microwave simulators, are necessary for almost any complex designs found in modern circuits. By attending these classes, you will significantly bootstrap yourself into proficient understanding and usage of the below described topics. The huge return on this small investment has been confirmed by 100’s of customers over the past years.

This class will be led by qualified Keysight instructors. The price of the 3-day class is 1470€. Lunch and refreshments are served during the training days.

 


Detailed agenda:

 

Day 1 (Tuesday 14 October)

EM Component Parameterization, Cosimulation & Cooptimization

EM Component parameterization is the basis for EM-circuit-system cooptimizations. Learn the two methods to convert static to parameterized geometries. Compare traditional “puzzle-piece” modeling approaches to large scale modeling. Understand and efficiently use thick conductor modeling using LTCC spiral inductors as examples.


Day 2 (Wednesday 15 October)

Efficient CPW & Multilayer Modeling & Analysis of Differential Structures

Use slot layers to efficiently model(CPW) Coplanar Waveguide and multilayer PCB structures. Learn the different grounding concepts such as localized grounds and return paths vs. ground at infinity, and differential signaling. Perform pure differential and mixed-mode (common–differential ) S-Parameter simulations using schematic temp-lates and DDS equations and understand the imp - lications this has on real-world differential signal routing.


Day 3 (Thursday 16 October)

Multitechnology Structures, IC Packaging, Modules, SiP

The Finite Element Method is the most general 3D simulation technique and allows users to simulate IC or multi-chip module packages and many other structures that Momentum cannot represent. FEM can also be used to validate Momentum simulations to increase confidence levels. Being integrated in a layout environment has significant benefits over having to draw 3D structures in a CAD UI as you will learn in this class.