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SI/PI PCB Design Considerations for Thermal Webcast

1   小时 | 网上直播 -- 已存档的 | 地点和时间

Typically signal integrity (SI) and power integrity (PI) engineers set or assume the temperature for analysis at room temperature. However, the temperature may be higher than that, depending on the DUT location on PCB. What thermal effects for SI and PI do we anticipate if the PCB temperature is high? In this webcast, we will review the thermal effects on your PCB designs and demonstrate the performance changes due to the temperature change based on a practical case study.

PRESENTER

Hee-Soo Lee, 3D EM Applications Specialist, Keysight EEsof EDA

Hee-Soo Lee holds a BSEE degree from the Hankuk Aviation University, Korea. He has more than 20 years of design and simulation experience in the area of RF and Microwave designs, and is currently the Applications Specialist for 3D EM solutions at Keysight EEsof EDA.

地点和时间

价格 地点 更多信息
免费 At Your PC Enroll to view the January 25, 2018 recorded broadcast 

显示价格为标准定价,如有变更,恕不另行通知。

培训及活动材料

SI/PI PCB Design Considerations for Thermal Webcast Slides 
Slides from the January 25, 2018 webcast

研讨会演示 2018-01-25

PDF PDF 3.21 MB