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EM Insights Series

This page contains a series of application examples that demonstrate how Keysight EEsof EDA electromagnetic (EM) simulation software tools can be used to solve actual design problems. Each episode in the series represents a specific design challenge and shows how the appropriate Keysight EM simulation tool can help designers.

In addition to the EM Insights Series shown below, be sure to have a look at our EM Applications Center.

EM Insights Series
Title/Description Image 
1.) QFN Package
IC design is not finished until it is packaged. What is the upper frequency limit that the package can operate? Is it possible to use a lower cost package type to lower the final product cost? What about the performance of package isolation? As an example, LO to RF leakage performance of an up- or down-converter IC depends not only on the IC’s isolation performance but also on the package. In this episode, a 3x3[mm],16-pin Quad Flat No Leads (QFN) package is optimized to improve the frequency performance using FEM Simulator G2.
QFN Package
2.) Single and Multiple Band Microstrip Planar Array Antenna
The major bottleneck in a planar microstrip patch antenna design is the capacity and speed issue of the field solver to handle a large size array antenna. The situation becomes more complicated when the antenna is used for multiple bands. In the past, the antenna problem was usually broken down into small sizes that were integrated (linearly added) later without carrying out an EM simulation at the full structure level. In this way, the coupling at the large structure level was not taken into account. This episode demonstrates how the new improvements to Momentum aids designers of large array of microstrip patch antennas.
Multiple Band Microstrip Planar Array Antenna
3.) Wireless Network Card Antenna Design
There are many EM simulation technologies and tools available in the market that antenna designers can use, but which is the best one for the job? This episode demonstrates the use of Electromagnetic Professional (EMPro) in the design of wireless network card antenna. The ultra-fast simulation capability of EMPro enables designers to quickly test and verify different configurations and sizes of antenna. EMPro’s slick visualization feature also enables designers to visualize the current and field pattern on the antenna surface; consequently, it visually helps designers effectively design smaller antennas.
 Wireless Network Card Antenna Design
4.) Contactor Design in High Volume RF Test Fixtures
The contactor is central to the design of high volume RF test fixtures. It acts as the final link connecting the RF test system to the RFIC package. In the past, high volume contactors were used primarily for testing digital ICs. However, with clock speeds exceeding 1GHz and higher operating frequencies of ICs, the performance degradation due to the contactors can be no longer ignored. This episode demonstrates how EMPro helps you to quickly analyze and understand the impact of the contactors to the overall test performance, consequently the production yield.
 Contactor Design
5.) BGA Package Simulation
A Ball Grid Array (BGA) package is a very popular package style for high speed digital applications due to high density, low thermal resistance, and low inductance leads. However as the operating frequency and data rate go up, it is critically important for IC designers to understand the package’s electrical performance because of the parasitics that can come from the package. This episode demonstrates fast and accurate analysis of BGA packages with Momentum to get the desired package performance right the first time.
BGA Package Simulation
6.) High Speed Connector Modeling with EMPro
Accurate modeling and simulation of high speed connectors is critical to successful high-speed signal transmission. This episode demonstrates how a time domain based EM simulator helps in identifying problem areas, and discontinuities of connectors. The speed of the simulator makes it easy to run multiple simulations for a better understanding and to optimize for a good impedance profile throughout the transitions. As a result, high performance connector designs can be achieved.
High Speed Connector Design
7.) High Speed SATA Connector Modeling with EMPro
Due to the faster data transfer rate required in today’s consumer electronics market, interconnect design, such as Serial Advanced Technology Attachment (SATA) to PCB interface, can no longer be ignored. Designers must include electromagnetic effects (coupling, crosstalk, etc.) of SATA connectors with board traces for accurate signal integrity analysis. In this episode, a SATA connector is analyzed with EMPro. Then the EMPro simulation file is exported as a design kit into ADS so that the connector data can be re-used for signal integrity analysis along with other circuit components in ADS.
High Speed SATA Connector
8.) Solder/Wafer Bumps for Flip Chip, CPS, and WLP Applications
The popularity of solder/wafer bumps brings a new set of design challenges that require 3D full wave EM tools. This episode demonstrated how an ADS parameterized 3D component design kit enables designers to quickly draw 3D components such as solder bumps and co-design/optimize them with other schematic components. This integrated 3D EM design flow saves cycle time and increases first pass design success.
Solder Bumps
9.) Dielectric Bricks, Laminates, LTCC 3D Em Simulations
Often 3D planar EM simulation technology is adequate for most laminate/LTCC/module applications; however there are cases were full-wave 3D EM simulations provide better accuracy. This episode discusses two such applications and the advantages of using FEM Simulator G2.
Dielectric Bricks
10.) Mechanical Shield for RF/MW Circuit Designs
Accurately predict the performance of RF & Microwave board/module designs with mechanical shields by using custom 3D EM components in ADS without exporting/importing designs to 3D EM tools.
Mechanical Shield
11.) An Oscillator Design Flow with Integrated 3D EM
Learn how 3D EM integration can improve the predictive design of VOCs. Simulation accuracy is increased by taking into account the interaction between resonator and board design.
12.) Simulation of Defected Ground Structure
This presentation covers DGS Technology: an intentionally designed defect on the ground plane creates additional effective inductance and capacitance that results in microstrip lines with higher impedance, band rejections, and slow wave characteristics.
Defected Ground Structure

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