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Accurate Interconnect Analysis

Improving interconnect performance and increasing confidence that the manufactured product will function as simulated is crucial in MMIC design. Additionally, there are many types of physical layout components such as high speed connectors, bond wires, and dielectric bricks that require three-dimensional electromagnetic analysis for any arbitrary geometry.

To better address these concerns, the Momentum Planar EM and 3D Finite Element Method (FEM) simulators are now fully and tightly integrated into Keysight's Advanced Design System (ADS), and can easily be accessed in the same design environment. This enables you to verify the proximity effect of chip area compaction, as well as effects of bond wires and packaging, and then to take corrective action on performance and yield early in design process.

The Momentum simulator is the industries' first 64-bit, 3D-Planar EM Solver and now includes a Krylov Iterative Solver. It hosts three unique solvers to address the varying degrees of EM modeling complexity and extend EM modeling efficiencies across a much wider application coverage area. As a result, you can solve bigger problems, previously not solvable, much faster.

The full-wave and quasi-static solvers and adaptive mesh reduction available with Momentum cover your EM analysis needs from microwave frequencies down to DC. This is especially important to MMIC designers since it enables them to perform very fast design explorations while maintaining accuracy. Momentum also now features improved thick conductor modeling capabilities. Horizontal current modeling on the metal interconnect sidewalls, as well as the vertical currents, have been added for accurate loss or Q calculation at high frequency and shrinking process geometries.

Bond Wire Drawing

In Package Bond Wires

The 3D Finite Element Method (FEM) solver integrated into ADS features an improved 3D viewer and bond wire modeling capability with JEDEC parameter entry. Together with Momentum, it eliminates the need for you to have to leave your design environment to use an EM tool. Rather, with ADS, you can do your full front-to-backend design and EM verification all in one single environment.

After your MMIC is designed, it is packaged and mounted onto a board. Here package effects must be considered in overall design performance. ADS features a unique ability to simulate not only the IC, but also the package and test board as well, so that you can accurately predict in-circuit performance. Momentum RF, a quasi-static EM simulation engine available in ADS helps ensure accuracy when results are translated to time domain for further analysis. You can now make sure that your MMIC will work 100% after you insert it into its package and after you attach its input and output wire bonds.

Three-dimensional Viewer

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