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RF System-in-Package & RF Module Design

RF System-in-Package DesignThe trend in the wireless industry toward smaller form factor and more functionality has been driving technology innovations for continued increase in functional density and a decrease in the cost per function. SiP, SoP, and 3DIC technologies are rapidly evolving from a specialty technology used in a narrow set of applications, to a high volume technology that addresses current market and design challenges. However the complex design problems with mixed signal, mixed mode, multi-technology, increased interconnect density and closer design proximity has also increased design challenges to meet design requirements faster and at a lower cost.

Keysight EEsof EDA is the market and technology leader in RF SiP & RF Module design solutions offering:

  • The best methodologies for designing SiPs with high confidence
  • The best RF SiP co-design platform
  • The best way to reduce design failure risks due to unpredicted parasitics

RF SiP/Module Technology Overview

RF SiP/Module Design Value

RF SiP/Module Design Flows

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Keysight EEsof EDA Newsletter - Product and Application News 
Keep tabs on the latest product and application news and review the archives of the Keysight EEsof EDA Newsletter.

Newsletter 2019-04-09

 
Follow Keysight EEsof EDA on Twitter! 
Twitter enables you to keep current on news and updates with Keysight EEsof through the exchange of quick, frequent answers to one simple question: What are you doing?

Newsletter 2016-07-14

 
Design and Characterization of Discontinuous RF/Microwave Passive Components 
This Article by Dean Nicholson presents a design methodology proposed for designing and building RF circuits likely to contain discontinuous regions.

Article 2014-07-31

PDF PDF 1.43 MB
RF SiP Design Verification Flow with Quadruple LO Down Converter SiP  
This article reprint by HeeSoo Lee and Dean Nicholson outlines the design flow used for a System-in-Package component, using multiple die integrated into a single packaged device.

Article 2014-07-31

PDF PDF 505 KB
A Packaged 60 GHz Low-Power Transceiver with Integrated Antennas for Short-Range Communications 
This paper describes a 60-GHz transceiver with integrated antennas for short range and low power wireless communications fabricated in a CMOS 65nm SOI technology.

Article 2013-03-25

PDF PDF 429 KB
Achive First-Pass LTCC Design Success With DFM 
Understanding the effects of process and component variations can help in constructing LTCC circuit designs that deliver desired performance levels in spite of those variations.

Article 2007-05-01

PDF PDF 2.43 MB
How to Build EM-Accurate Parameterized Passive Models? 
An Article by Mounir Adada (Keysight Technology) highlights how modern EM parametric modeling tools can contribute in getting the products out the door right the first time.

Article 2002-05-30

PDF PDF 165 KB
Overview: Applying Nonlinear RF Device Modeling to Verify S-Parameter Linearity 
This Article is intended to explain the basics of “what’s behind S-parameters” from a modeling engineer's standpoint & on how to apply Harmonic Balance simulators to check the validity of device models.

Article 2001-09-01

PDF PDF 460 KB