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RF System-in-Package & RF Module Design

RF System-in-Package DesignThe trend in the wireless industry toward smaller form factor and more functionality has been driving technology innovations for continued increase in functional density and a decrease in the cost per function. SiP, SoP, and 3DIC technologies are rapidly evolving from a specialty technology used in a narrow set of applications, to a high volume technology that addresses current market and design challenges. However the complex design problems with mixed signal, mixed mode, multi-technology, increased interconnect density and closer design proximity has also increased design challenges to meet design requirements faster and at a lower cost.

Keysight EEsof EDA is the market and technology leader in RF SiP & RF Module design solutions offering:

  • The best methodologies for designing SiPs with high confidence
  • The best RF SiP co-design platform
  • The best way to reduce design failure risks due to unpredicted parasitics

RF SiP/Module Technology Overview

RF SiP/Module Design Value

RF SiP/Module Design Flows

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IMS 2015 Demos from Keysight EEsof EDA 
YouTube video playlist containing International Microwave Symposium (IMS) 2015 demo videos from Keysight EEsof EDA MicroApps.

Demo 2015-06-19

 
How to Predict Package and Bondwire Effects on Your RF-Module Designs 
This short video shows how to predict package, board, and bond wire effects on your RF-module designs which subsequently enables you to fix the design prior going to fabrication. The video demonstrates the process of building modules that comprise different technologies and performing EM simulation on them.

How-To Video 2015-02-19