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Medalist i3070 Test Throughput Optimization - Application Note 
This application note explores some factors which cause test time to increase on the Medalist i3070 In-Circuit Test system, and methods which users can employ to reduce the test time and increase throughput on the Medalist i3070 ICT system.

應用手冊 2017-06-16

“Shotgunning”, a Bad Fit for Lead-Free Test 
Shotgunning, a common repair technique in functional test, will be negatively affected by lead-free processes. This article explores the technique and draws broad conclusions regarding the impact of lead-free on electronics manufacturing test

應用手冊 2015-07-14

PDF PDF 99 KB
IEEE 1149.6 Standard Boundary Scan Testing on Keysight Medalist i3070 ICT Systems 
This paper introduces the latest advancements in Boundary Scan test capabilities on the Keysight Medalist i3070 In-Circuit Test platform that supports the testing of IEEE 1149.6-compliant devices.

應用手冊 2008-11-24

PDF PDF 297 KB
First pass Yield (FPY) and Alarm Triggers on the Keysight Medalist i3070 In-circuit Test System 
This application note will explain some customizations and how to create alarm triggers.

應用手冊 2008-09-26

PDF PDF 131 KB
Medalist 3070 and Medalist i5000 System Recovery using Retrospect Express 
This app note describes how to perform backups of the system hard disk for the Keysight Medalist 3070 and Keysight Medalist i5000 In-circuit Test systems that have been shipped with Retrospect Express 7.0 and Roxio Digital Media Plus 7.2 software.

應用手冊 2007-07-10

PDF PDF 628 KB
Maximising Test Coverage with Keysight Medalist VTEP v2.0 
This paper describes how to get the most from Keysight Technologies’ industry-leading vectorless test innovation, the Medalist VTEP v2.0 which is a suite of solution comprising VTEP, iVTEP and NPM.

應用手冊 2007-04-17

Applying a New In-Circuit Probing Technique for High-Speed/High Density Printed Circuit Boards 
Bead probes were used to obtain additional test access on a high-density production printed circuit board. This case study includes practical information and key bead-specific learnings discovered during the process of outsourcing.

應用手冊 2006-10-24

Test and Inspection as Part of the Lead-free Manufacturing Process 
The paper addresses issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. It also addresses different test and inspection systems’ readiness to test lead-free printed circuit board assemblies.

應用手冊 2005-02-22

PDF PDF 421 KB
The Importance of Test and Inspection When Implementing Lead-Free Manufacturing 
Many papers, articles, and studies have been written about process issues, reliability issues, repair issues, and the merits of different alloys. This paper addresses the impacts on test and inspection when going lead-free.

應用手冊 2004-08-20

PDF PDF 260 KB
Using Lead-Free PCB Finishes at Manufacturing In-circuit Test Stage 
The purpose of this document is to share experiences and educate engineers regarding different PCB surface finishes and the specific changes required in the PCB build process to allow for ICT.

應用手冊 2004-08-08

PDF PDF 102 KB
Test Coverage: What Does It Mean when a Board Test Passes? 
Originally presented at the 2002 International Test Conference -- Characterizing board test coverage as a percentage of devices or nodes having tests does not accurately portray coverage, especially in a limited access testing environment.

應用手冊 2003-07-28

PDF PDF 266 KB
What to Consider When Selecting the Optimal Test Strategy 
This paper addresses several issues for selecting the optimal inspection strategy, presenting data from many studies that Keysight has performed in the quest to find the optimal test / inspection strategy.

應用手冊 2003-03-01

PDF PDF 175 KB
Using Boundary Scan to Link Design and Manufacturing Test 
By leveraging boundary-scan tests generated in Design and re-using them at Manufacturing Test, manufacturers can produce long-term benefits in terms of lower costs, greater efficiencies and higher quality products.

應用手冊 2003-03-01

PDF PDF 502 KB
Boundary Scan Helps EMS Companies Cut Test Costs and Increase Revenues 
Electronics Manufacturing Services (EMS) providers can utilize boundary-scan to reduce test cost expenses and also generate additional revenue opportunities.

應用手冊 2003-03-01

PDF PDF 242 KB
Ground Bounce Basics and Best Practices 
This article offers a description of the physical properties that result in ground bounce during board test.

應用手冊 2003-01-28

PDF PDF 138 KB
A New Process for Measuring and Displaying Board Test Coverage 
Written by Kenneth P. Parker, Keysight Technologies. First presented at Apex 2003, Anaheim, California.

應用手冊 2003-01-01

PDF PDF 116 KB
3070 Board Tests are Reliable, Repeatable and Transportable. Here's Why. 
It would take a very long paper to discuss all of the factors that make Keysight 3070 tests so reliable, repeatable, and transportable. This paper selects a few of the important ones.

應用手冊 2001-08-15

PDF PDF 223 KB
Up-and-Down Programming DUT Power Supplies 
There seems to be some confusion on what the current limits are when using the DUT supplies in the Keysight 3070 system. While this article is not meant to be an exhaustive treatise on the subject, a little clarification might help.

應用手冊 2001-05-17

PDF PDF 23 KB
Improved Fault Coverage in a Combined X-ray and In-Circuit Test Environment 
Cutting functional test failures in half and doubling the faults detected at process test! These are some of the case study results observed in combined X-ray and in-circuit test environments.

應用手冊 2001-02-27

PDF PDF 575 KB
Electrical In-circuit Test Methods for Limited-access Boards 
This paper surveys the various electrical test methods and tools available to address testing boards that lack full electrical access.

應用手冊 2001-02-27

PDF PDF 47 KB
Boundary-Scan Technology, Justification, and Test Implementation for Designers 
This paper provides practical insight for designers on the merits, design, and test implementation of Boundary-Scan Technology.

應用手冊 1998-05-27

PDF PDF 29 KB