Using Lead-Free PCB Finishes at Manufacturing ICT Stage
白書
Historically, the test engineer has been primarily concerned with ensuring he has an effectivetest program that performs well in production. In-Circuit test is still a very effective method of detecting manufacturing defects. More advanced In Circuit Test (ICT) systems can also add real value in configuring functionality at test by providing the means to program flash memory, PLD,FPGA and EEPROM. Keysight Technologies, Inc.’s 3070 system is the market leader in ICT.
It is established that In-Circuit test still has plenty to offer to the manufacturing and testing of Printed Card Assemblies, (PCA), but how will the pursuit of a lead free PCB affect the ICT stage in the future?
The push for lead free solder techniques has led to many investigations into PCB finishes. These have been primarily based on the technology performance during the build process. The effects of various PCB finishes on the test phase have mostly been overlooked or focused purely on contact resistance. This report will present details of the effects seen at ICT and the need to respond and understand these changes.
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