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New 6G research explores component selection and circuit design to operate in the sub-terahertz frequencies, i.e., around 250 GHz. This means that traditional RF circuit simulation would only be accurate enough by including 3DEM simulation of components with dimensions approaching the wavelengths at these frequencies. Fortunately, one design environment can now include 3D components such as helical inductor chips, connectors, transitions, and shields easily into a circuit schematic and layout for immediate 3DEM-circuit co-simulation. This improves the accuracy of simulation up to 250 GHz to avoid costly iterations. See how this is done in this tutorial video.
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