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Solder Paste Inspection and Management: SP50 Series 3

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主な特長と仕様

  • Full 3D inspection with speed up to 38.7cm^2/sec (6in^2/sec) *speeds may vary depending upon application
  • Head Swap to SJ50 Series 3 available
  • 19.5x19.5” (500x500mm) board size capability
  • CMOS camera
  • 16 μm per pixel resolution (scalable)
  • 4 μm height resolution
  • Shadow free dual laser triangulation inspection method

概要

The SP50 provides users with blazing throughput, excellent repeatability, and full volume, height, area, and registration measurements. The SP50 can handle boards up to 19.5x19.5” and has the advantage of the Keysight head swap technology. The head swap allows users to alternate their equipment from an SP50 to an SJ50 with a simple procedure that takes less than one hour. The SP50 uses optical encoders and linear motors to allow smooth transitions.

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