Introducing MBP 2014.04

MBP 2014.04 introduces a number of new features and major enhancements to help modeling engineers increase modeling productivity. As the complete silicon turnkey device modeling software, MBP 2014.04 equips the automated extraction packages for industry standard models and provides the turnkey solutions for specialty modeling such as statistical modeling and layout proximity effects (LPEs) modeling.

Model support list

The internal engine continues supporting the newly released CMC standard models and their latest versions.

Integrated data flow across Keysight device modeling platform

The enhanced capability allows loading IC-CAP WaferPro and WaferPro Express measurement results directly for modeling without any additional data conversion. Users can multi-select data files or load the data files under directory level all at once. Besides the sweep data (.mdm) and spot data (.csv), it also enables users to query and load measurement data stored in SQL/SQLite databases.

BSIM6 baseband model extraction package

BSIM6 is the latest industry standard bulk MOSFET model from UC Berkeley. The model provides excellent accuracy compared to measured data in all regions of operation. It features model symmetry valued for analog and RF applications while maintaining the strong support and performance of the BSIM model valued for all applications. The new BSIM6 baseband model extraction environment in MBP 2014.04 enables users to run the automated flow for baseband model extraction. It also allows users to customize their own extraction flow using the graphical user interface (GUI) and on the fly. Users can adjust the extraction steps dynamically in the interactive GUI without coding or compiling. It provides users a more flexible, automated modeling environment where greater attention to intermediate extraction results and more engineering judgment calls are often required for this new charge-based model.

BSIM-CMG baseband model extraction package

BSIM-CMG is a compact model for the class of common multi-gate FETs from UC Berkeley. Physical surface-potential-based formulations are derived for both intrinsic and extrinsic models with finite body doping. In 2012, BSIM-CMG became the first industry standard FinFET SPICE model. The new BSIM-CMG baseband model extraction environment in MBP 2014.04 enables users to run the automated flow for baseband model extraction. It also allows users to customize their own extraction flow using the graphical user interface (GUI) and on the fly. Users can adjust the extraction steps dynamically in the interactive GUI without coding or compiling. It provides users a more flexible, automated modeling environment where greater attention to intermediate extraction results and more engineering judgment calls are often required for cutting-edge FinFET technologies.

Enhancement on statistical modeling

The continued scaling of CMOS transistors to nanoscale has increased variations in transistor characteristics, which impacts the ICs performance and yield. MBP continues to enhance its industry leading solutions on statistical modeling. In MBP 2014.04, the turnkey statistical modeling flow is developed. In the brand-new and dedicated UI, users can complete the whole modeling flow from data dispose, automated parameter extraction, and fast simulation, to the final global statistical and local mismatch model generation.

Looking for another version? View other MBP Product Versions.