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Application Notes
Introduction
Beam lead devices are particularly suited for hybrid integrated circuits where low parasitics and small size are prime requirements. Available as single units or monolithic quads, the beam lead devices have made high packing density and superior performance easily achievable in hybrid circuits. There are single beam lead devices in four different outlines—05 and 10 for Schottky diodes, 06 and 07 for PIN diodes. A picture of the HPND-4001 PIN diode in outline 07 appears in Figure 1. As typical of the single beam lead devices, this beam lead PIN diode consists of a silicon chip with coplanar plated gold tabs (beam leads measuring barely 5 mils wide and 0.5 mil thick) 9 mils beyond the edge. The detailed dimensions of outline 07 shown in figure 2 illustrate the small size of the beam lead package, which results in little space needed in a circuit. the low package parasitics allow the achievement of maximum performance for the beam lead diode.
The construction of the beam lead diode is designed to offer exceptional lead strength without sacrificing electrical performance.
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