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Solder Paste Inspection and Management: SP50 Series 3 XL

Product Status: Obsolete | View Service Options
This product is no longer available

No replacement found for this product.

Key Features & Specifications

  • Full 3D inspection with speed up to 38.7cm^2/sec (6in^2/sec) *speeds may vary depending upon application
  • Head Swap to SJ50 Series 3 XL available
  • 23.5x23.5” (610x610mm) board size capability
  • CMOS camera
  • 16 μm per pixel resolution (scalable)
  • 4 μm height resolution
  • Shadow free dual laser triangulation inspection method

Description

The SP50 provides users with blazing throughput, excellent repeatability, and full volume, height, area, and registration measurements. The SP50 can handle boards up to 23.5x23.5” and has the advantage of the Keysight head swap technology. The head swap allows users to alternate their equipment from an SP50 to an SJ50 with a simple procedure that takes less than one hour. The SP50 uses optical encoders and linear motors to allow smooth transitions.

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