Highlights

  • Max node count: 2592
  • Max channel count: 576
  • Footprint: 1.49m x 0.94m / 4.89’ x 3.08’
  • Max no. of modules: 2

Stay Connected. Evolve Continuously

Keysight's family of i3070 Series 6 In-Circuit Test (ICT) systems are built on a proven technology foundation, and they improve test efficiency with time-tested software, hardware, and programmability. I3070 Series 6 ICT tester supports a wide range of printed circuit board assembly (PCBA) sizes for applications including IoT and 5G, as well as automotive and energy. The i3070 features a unique design that delivers the shortest signal path between measurement circuitry and devices under test to minimize undesired effects from parasitic capacitance, improve immunity to crosstalk, and eliminate stray signal coupling effects, delivering consistent and repeatable measurements. The Series 6 is fully backward compatible with previous systems and makes highly repeatable measurements.

i3070 Series 6 ICT offers customers:

  • Improved test efficiency with >40% faster Silicon Nails / Boundary-Scan testing and >6% faster overall testing on most PCBAs
  • 100% backward compatibility guarantees minimal downtime for installation and complete code compatibility
  • Certified machine-to-machine (M2M) capabilities such as IPC Connected Factory Exchange (IPC-CFX) and IPC-HERMES-9852 standards offer increased operation efficiency, greater test data insights, shorter response times, and reduced operating expenses.
  • Modern software licensing demystifies license costs, centralizes license management, and scales to meet production demand.
  • The new i3070 Series 6 in-circuit test platform provides transportable test capabilities and adds advanced Industry 4.0 technology to deliver high yield, fast throughput, and best-in-class operational efficiency for our top-tier printed circuit assembly manufacturing customers.
 

Key Specifications

Fixture Actuation
Vacuum
Max Node Count
2592
Max Parallel Testing
2
System Type
Offline System
System Width
1490 mm
Fixture Actuation
Max Node Count
Max Parallel Testing
System Type
System Width
Vacuum
2592
2
Offline System
1490 mm
View More
Fixture Actuation:
Vacuum
Max Node Count:
2592
Max Parallel Testing:
2
System Type:
Offline System
System Width:
1490 mm
E9903G 4-Module ICT System, i307x Series 6

Interested in a E9902G?

Featured Resources for E9902G 2-Module In-Circuit Test (ICT) System, i317x Series 6

Application Notes 2024.01.30

Streamlining In-System Programming

Streamlining In-System Programming

This application note explores the challenges and solutions in implementing In-System Programming (ISP) on densely populated circuit boards. Focusing on Keysight's advanced ICT system, the document discusses upgraded hardware configurations and introduces the ISP OpenTAP plug-in for streamlined test sequence generation. With a simplified approach to test generation and execution, Keysight's solution offers an efficient pathway for ISP integration. This resource serves as a practical guide for test engineers seeking to optimize ISP processes, enhance efficiency, and reduce complexities in programming.

2024.01.30

Application Notes 2024.01.30

Integrating x1149 Boundary Scan Analyzer for Enhanced Modularity and Versatility

Integrating x1149 Boundary Scan Analyzer for Enhanced Modularity and Versatility

This application note explores the integration of Keysight's x1149 Boundary Scan Analyzer with the i3070 Series 7i In-Circuit Test System, introducing a flexible and efficient approach to boundary scan testing. The integration eliminates challenges associated with built-in boundary scan systems, offering enhanced security, modularity, and greater flexibility in adapting to evolving protocols and functionalities.

2024.01.30

Application Notes 2024.01.29

New i3070 Series 6 is 1.5x Faster than the Series 5

New i3070 Series 6 is 1.5x Faster than the Series 5

This application note summarizes some of the results of Vectorless Test Enhanced Probe (VTEP) early tests conducted at customer sites.

2024.01.29

Application Notes 2024.01.25

Quad Density Pin Card for Enhanced Throughput and Reliability

Quad Density Pin Card for Enhanced Throughput and Reliability

This application note addresses the evolving challenges in testing modern and densely packed Printed Circuit Board Assemblies (PCBAs) and introduces the Quad Density (QD) pin card as a groundbreaking solution. As electronic systems grow in complexity, the need for comprehensive testing becomes crucial. The current limitations of double-density pin cards prompt the development of the QD pin card, which offers 320 test pins on a single board, more than doubling its predecessor's capabilities. The QD pin card not only enhances test pin capacity but also introduces features like built-in discharge circuits and temperature sensors to optimize testing efficiency. Backward compatibility ensures seamless integration with older testing systems, and electronic serial number storage facilitates easy identification and troubleshooting.

2024.01.25

Application Notes 2024.01.24

Advancing Cluster Testing for High-Density PCBA in Automotive Electronics

Advancing Cluster Testing for High-Density PCBA in Automotive Electronics

This application note delves into the dynamic evolution of Printed Circuit Boards (PCBs) and the challenges posed by the advent of multilayered PCBs, particularly in the context of limited test points. It explores the significance of testing these intricate structures and introduces the concept of cluster testing as a solution.

2024.01.24

Application Notes 2024.01.23

Enhanced Short Tests for High Impedance Nodes

Enhanced Short Tests for High Impedance Nodes

This application note introduces an Enhanced Short Test algorithm tailored to tackle the testing challenges associated with high-impedance nodes in Printed Circuit Board Assemblies (PCBAs). Integrated into the Keysight In-Line High-Density In-Circuit Test (ICT) system, the Enhanced Short Test significantly boosts the efficiency of short detection for high-impedance nodes, leading to a noteworthy 57% reduction in testing time. High-impedance nodes, commonly found in modern PCBAs to enhance signal quality and reduce power consumption, present difficulties such as extended stabilization times, heightened sensitivity, diminished current flow, intricate isolation procedures, and concerns regarding signal stability.

2024.01.23

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