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W2346EP Circuit Envelope Distributed Computing 8-Pack Element

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Prices for: United Kingdom

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The Circuit Envelope Distributed Computing 8-Pack Element accelerates the simulation of circuit envelope (CE) by running up to 8 parallel simulations of CE on 8 nodes of a compute cluster. This is especially useful for large simulations of complex digitally modulated RF signals in addition to templates for designing linearizers, RF Systems, and PLL Systems.

Configuration Information:

  • Requires separate compute cluster management system such as LSF and SunGrid.
  • Requires the CE Simulator in the Circuit Envelope Element.