Product feature/capability added or improved |
ADS
2012.08 |
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Circuit Simulation Enhancements |
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New Electrothermal Circuit Simulation
- Provides higher accuracy 'thermally aware' circuit simulation results
- Includes effects of on-chip temperature rise
- Avoid thermal runaway, current crowding, memory effects
- 3-D temperature map of the full chip and package
- Pinpoint where to change the layout
- Easy to set up and use from within the ADS environment
- Works with all simulation types: DC, AC, SP, HB, Transient, Envelope
- Applications: high power RFIC / MMIC design
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NEW NeuroFET Model
- Artificial Neural Network Measurement-based FET Model
- Complete Solution: data acquisition, extraction and simulation in ADS
- More accurate than other data-based models compact models
- Accurate 2nd, 3rd, Nth order effects
- Robust RF & DC convergence and improved small-signal distortion
- More accurate PAE and S-parameters vs. bias
- Applications: GaN, InP, GaAs
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Updated Nonlinear Models
- BSIM 4.7.0
- BSIM-CMG 106.0.0
- HICUM 2.3.1
- HiSIM 2.5.1, 2.6.0, 2.6.1
- HiSIM_HV 1.1.2, 1.2.2, 1.2.3, 2.0.0, 2.0.1
- SiMKit 3.8
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Harmonic Balance
- Automatically moves past stuck points to improve convergence
- Better convergence and faster performing oscillator analysis
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Transient GPU analysis
- 8X faster than a standard CPU and about 2X faster than first generation GPU support
- Newly supported – R, C, L, and K models.
- Supported on Windows (32 & 64 bit) and Linux 32 & 64 bit platforms
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Dynamic Link
- Fully automated Dynamic Link encryption simplifies sharing of IP
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Linear Collapser
- The Linear Collapser is fully automated
- Does not require a controller to be placed on the schematic
- Improves simulation performance
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X-Parameters
- More accurate when simulating at different load points
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Multi-technology Simulation Improvements |
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Multi-Chip Module FEM Simulation
- Supports 3D FEM simulations on side by side ICs on a module
- Analyze coupling effects between system components
- Easy technology setup
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Improved Multi-technology Circuit Simulation
- New Multi-Technology mode
- Supports different ambient temperatures for each IC/Module/subcircuit
- Supports different instance scale for each IC/ Module/subcircuit.
- Can override for all instances of a specific subcircuit
- Can set different temperatures on an instance basis
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New Layout Features and Improvements
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New Navigator Window
- Displays all the objects in a design
- Shows the entire design hierarchy
- Can cross-probe between the Navigator and the design window
- Window can be docked
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New Search Utility
- Easy to search for any object in the design hierarchy
- Wizard to quickly set up search criteria
- Selecting the objects in the Search window will automatically zoom to the object
- Automatically opens the containing design if in the hierarchy
- Window can be docked
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New Docking Windows
- The Search, Navigator, Info, Layers and the Properties dialogs can be docked
- Drag the windows to dock on any side of the window
- Can stack windows or create tabbed windows or a combination
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New Flight Wires
- Improve the display of connectivity
- Cleaner point to point display, makes design editing easier
- Can optionally be turned or retain previous physical wires
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Multiple Connectivity Modes
- Provides flexibility in how the underlying connectivity is created
- Helps fit ADS to the user’s design style
- Provides 3 modes – 2011 mode, standard, and manual
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Improved netname management
- Can now create custom names for nets
- Makes the design easier to understand
- Can force nets so they have a persistent connectivity
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Net Overlap Zones
- Highlights when objects that have different netnames overlap
- Helps identify potential errors
- Gives an easy way to fix or ignore the error
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Copy & Oversize
- Single click to create multi-layer structures from selected shapes
- Can both oversize and undersize
- Can merge multiple shapes into polygons
- Can include multiple steps into a single operation
- Can save and restore multiple operations
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Lock Components
- Prevents designers from accidentally moving components while editing designs
- Prevents components from moving when doing a design synch
- Can optionally display a rectangle to indicate a locked component
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Improved Rotate functionality
- The rotate functionality has been integrated with other commands, such as copy, paste, and move
- Reduces multi-step operation to a single operation
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Display of Origin
- Layout origin (0,0) is now full screen and easy to see
- Color is user configurable
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Improvements to Rulers and Dimension Lines
- Rulers can now be placed at 45 and 90 degree locks
- Insures more accurate measurements
- Rulers are now placed on reserved system layers
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ADS PDE Platform Improvements |
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New flexible Archive and Unarchive features
- Gives more control over what is archived
- Helps insure that all the required data is included in the archive
- Can archive multiple workspaces, libraries, and PDKs referenced by current workspace
- Can archive a subset of the workspace to archive, down to an individual single cell
- Can easily include the sub-cell design hierarchy, even across multiple libraries
- Can choose not to archive data sets or EM simulation results
- On unarchive, you can choose all or a subset of the archive
- Can unarchive workspaces, libraries, PDKs to different directories
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Data Management
- New version control for ADS
- Uses ClioSoft SOS Data Management product
- Create and manage new design versions
- Rollback design to a previous version
- Seamless integration inside ADS Flow
- Right-click popup menu for version control
- SOS menu in ADS library browser window
- Check-out lock & check-in to prevent concurrent changes
- Auto-checkout when changes made
- Support for delete & rename
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64 bit support for Schematic and Layout |
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Data Display
- Data Display Dynamic Readout
- Hover over a plot to see the plot value
- An alternative to using markers
- Improved performance for Momentum results
- Can be up to a 10X improvement
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Improved graphics for external output
- Now support Vector Graphics (SVG) Format for Print to File
- Vector graphics maintains its accuracy when it is scaled
- Works with Schematic, Layout, Data Display, and the Notebook
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Support Enhanced MetaFile (EMF) format for Clipboard
- Maintains its accuracy when scaled
- Works with Schematic, Layout, Data Display, and the Notebook
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New file formats supported for Print to File
- BMP, JPG, PNG, PPM, TIFF, XBM, XPM, and SVG
- Works with Schematic, Layout, Data Display, and the Notebook
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Improved conversion of pre-2011 DSN Projects
- Can select a technology definition from an existing library
- Prevents the creation of multiple libraries
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DRC and LVS Enhancements
- New function to check metal area coverage ratio
- New function to determine inverse of a shape on a layer
- Can define object as Layout only to reduce false LVS errors
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Design Translation
- ADS Design Flow Integration (ADFI)
- Faster transfer of Allegro designs with positive layers
- Easier to install as an AEL Add-On
- Schematic and symbol views are created for all designs in the design hierarchy
- New option in Allegro to expand hatch patterns
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New PDK Builder |
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Electro Magnetic Simulation - FEM |
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New highly accurate DC/low frequency simulation algorithm |
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New ADS-EMPro integration in combination with EMPro 2012
- Operates through a common database
- Support for co-simulation between circuit simulation and parameterized 3D components simulated with FEM
- Support for adding ports on 3D components added to ADS layout
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FEM performance improvements – typically 1.4x faster than in ADS 2011 |
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Remote simulation support using LSF |
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Interrupt simulation phase option for FEM simulations |
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Capability to visualize fields based on circuit simulation excitations |
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Setup Enhancements
- Specify Data Display to open
- Limit post-processing data storage to user-defined frequencies
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Technology Definition
- For the situation where there are multiple substrate definitions, it is possible to define one of them as the default
- The Substrate Editor now graphically shows which layers are controlled by a boundary layer when defining finite dielectrics for FEM simulation
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Electro Magnetic Simulation - Momentum
- Supports conductor permeability (ferrite conductors)
- Improved overlap extraction and mesh reduction around vias
- Far fields for multiple frequencies
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DesignGuides |
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Improved Amplifier DesignGuide
- Many setups for analyzing the performance of BJTs, FETs, and amplifiers
- Simulation setups (with data displays) for power sweeps, to show performance at specific output power
- Gain compression setups to handle the maximum gain point as the 0-dB reference
- Specify gain or noise values for plotting gain and noise circles
- Easily plot circles at different frequencies across a band
- Circulation of input and output reflection coefficients and impedance
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Improved Load Pull DesignGuide
- Easier to find suitable simulation setups
- New optimization to find best load impedance while sweeping output power for measured load pull data
- Three new load mismatch setups to investigate amplifier performance degradation due to load VSWR variation
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High Speed Digital Design |
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New product W2324 High Capacity Layout Pre-processor supports selection of critical nets for EM modeling
- Imports ODB++ data generated by other PCB tools
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New re-driver component in Channel Simulator based on a pre-standard extension to IBIS AMI
- Electrical re-drivers
- Opto link models
- Crosstalk is modeled in channel simulations include re-drivers
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Ultra low BER measurements |
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Multiple Eye Probes in Channel Simulator with AMI Tx/Rx |
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Support for IBIS 5.1 including BIRDs 120 and 130 |
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Pre-standard support for advanced jitter and jitter stress test (BIRD 123), and on-die S-Parameters (part of BIRDs 116-118) |
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S-parameter circuit creation through Schematic Wizard
- Imports port and net names
- Enhanced symbol generation including odd-ports-left, even-ports-right, dual in-line symbol
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New Navigator for net exploration in complicated layouts |
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New DesignGuides for PCIe, USB3, HDMI, SAS2, UHS2 |
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Simulation Manager supports the new W2312 Transient Convolution Distributed Computing 8-pack |
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Fine-grain parallelism for RLC components using GPUs in Transient in W2500 Transient Convolution GT |
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Support added for HSPICE S-Element and S-Model |
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Improved power integrity example for heavily perforated power/ground PDN analysis using JEDEC DDR3 artwork |
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Measurement Expressions
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Instrument Link
- Support for more instruments including new PNA series, oscilloscopes, N5172B (EXG X-Series) and N5182B (MXG X-Series)
- ADS Support for PNA-X N524x series and the new PNA N522X
- VSA 89600B Source and VSA 89600B Sink now support 64 bit Windows and support Keysight 89600 VSA version 15 and later
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ADS Ptolemy
- Built-in ADS-SystemVue co-simulation components
- Improved automation of the SystemVue-ADS co-simulation flow in SystemVue 2012.06
- Support MATLAB 2012a co-simulation
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Documentation
- Four new Application Based Flows
- Seven new short How Do I Videos
- New Licensing Administrator's Guide
- New Feedback collection mechanism introduced in Local Help
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Ship Date (month/year) |
Nov
2012
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