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Innovations in EDA: Accurate Modeling of Packages and Interconnects Webcast
Webcasts
An important step in high frequency / high speed IC design is the characterization of IC performance within a realistic environment including packaging, interconnects, connectors, etc. There are several approaches to creating accurate models of these elements, such as creating equivalent circuit models, EM simulations, and measurements. This webcast will compare these different methods and examine the trade-offs of each. Several case studies are presented which compare measured and simulated results.
Where and When
Event Details
Price: Free
Location: At Your PC
For more information: View the recording of the Dec 2 , 2010 broadcast on
Prices shown are list prices and are subject to change without notice.
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