Column Control DTX

Mapping the Mechanical Properties of Solder with Nanoindentation

Application Notes

Electronic packaging reliability depends largely on the mechanical integrity of soldered interconnects. Thus, the purpose of this work was to use a new nano-indentation technique, Express Test, to map the hardness of a SAC 305 solder joint with gold plating. In this study after extended aging, the solder joint comprised three constituents: a tin-rich matrix, a bulk intermetallic AuSn4, and an interfacial intermetallic (Cu, Ni, Au)6Sn51. The softest material was the tin-rich matrix, which had a hardness of 0.51 ±0.07 GPa. The hardness of the bulk intermetallic was 2.12 ±0.18 GPa. The interfacial intermetallic had extraordinary hardness— greater than 8 GPa. Under uniform plastic strain, the mismatch in hardness between the interfacial intermetallic and surrounding material may increase the local stress intensity factor which drives interfacial fracture.

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Column Control DTX