How to Improve Lead-free Solder Joint Reliability

Application Notes

Motivated by our desire to understand and improve the mechanical reliability of solder joints in integrated circuits, we used instrumented indentation to measure the Young’s modulus (E) and strain-rate sensitivity (m) of a common lead-free solder alloy, SAC 105 (98.5% Sn, 1% Ag, 0.5% Cu). Measured values (E = 49.1 ±1.6 GPa, m = 0.184 ±0.013) were remarkably close to what others have measured for unalloyed Sn by means of uniaxial tension and compression experiments, thus lending credibility to the indentation method.

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How to Improve Lead-free Solder Joint Reliability

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