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Application Notes
The processing that is required to lower the dielectric constant in a low-k film has the adverse effect of degrading the mechanical properties of the film. Low-k films are subjected to many processes that test the strength of these films and their adhesion to the substrate such as chemical and mechanical polishing (CMP) and wire bonding. It is important for these materials to resist plastic deformation during these processes and remain intact without blistering up from the substrate. Ideally, a dielectric material will have a high hardness and elastic modulus because, traditionally, these two parameters help to define how the material will react when subjected to manufacturing processes. In this application note, scratch tests are preformed on several low-k samples using a ramp-load scratch test. The results from scratch testing and nanoindentation are examined through correlation analysis to better understand the interconnectedness of scratch results.
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