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High Speed Digital Design with Advanced Design System

Brochures

Today’s high-speed digital designers require EDA tools that accurately model RF and microwave effects, and that analyze not only signal integrity, but also the power integrity, and EMI/EMC of serial and parallel chip-to-chip data links. A prime example is signal integrity on serial links.

Increasing consumer and business demand for digital entertainment and information transmission is driving the need for high-speed systems such as routers, servers, mass storage system, and PCs.

Chip-to-chip connections inside these systems have undergone an architectural shift from parallel busses to serializer/deserializer (SerDes) links. Such serial links eliminate parallel bus clock skew and reduce the number of traces — advantages that come at the cost of large increases in bit rate on the remaining traces. At data rates greater than a gigabit per second and with channel light times longer than a bit period, signal integrity is a major concern. Under these conditions, high-speed analog effects, previously only seen in highfrequency RF and microwave engineering, can impair the signal quality and degrade the bit error rate of the link.

Keysight Technologies, Inc. EEsof EDA has for years been proud to offer Advanced Design System (ADS) as the premier simulator of RF and microwave effects. RF and microwave engineers trust ADS to analyze their circuits and to help them mitigate the impairments encountered at these frequencies. Now, through continuous research and innovation, Keysight EEs of EDA offers solutions that put the applicable simulators, libraries, and capabilities into the hands of highspeed digital engineers.

These bundles, listed in the table below, provide the most complete chip-to-chip data link analysis for standards such as Ininiband, PCI Express, RapidIO, DDR, HDMI, and Ethernet. They allow you to:

  •  Analyze complete chip-to-chip data links by co-simulating individual components, each at its most appropriate level of abstraction: link-, circuit- or physical-level.
  •  Import S-parameter accurately into transient simulation.
  • Generate ultra-low bit error rate (BER) contours in seconds not days.

These capabilities result in dramatically reduced product design cycles.

The following sections highlight key features of the elements that make up these bundles

Enhance your high speed digital bundle with these additional Elements:

·       W2303 Verilog-A Element

·       W2304 Verilog-AMS Element

·       W2343 Momentum Distributed

·       Computing 8-pack

·       W2312 ADS Transient Convolution Distributed Computing 8-pack

·       W2500 Transient Convolution GT

·       W2401 EMPro Core

·       W2342 FEM Simulator Element

·       W2405 FDTD Simulator Element

·       W1714 AMI Modeling Kit

·       W1713 SerDes Model Library

At today’s multigigabit per second chip-to-chip data rates, traditional SPICE-like lumped element components are not enough. High-frequency and distributed effects such as impedance mismatch, reflections, crosstalk, skin effect, and dielectric loss come into play.

Accordingly, signal integrity engineers need to go beyond traditional SPICE. ADS Transient Convolution Element accommodates not only lumpedelement models but also the distributed transmission line, S-parameter, and EM models that are essential to model high-speed PCB traces. The Transient Convolution Element is unique in that it is not simply a high performance point tool, but a set of capabilities integrated into the ADS platform. You can combine channel-, circuit-, or EM-level models – each at the appropriate level of abstraction –into one simulation.

Multicore processor support and a new, high-capacity sparse matrix solver achieve a three-fold simulation speed improvement for traditional transient simulations and make this the industry’s fastest signal integrity circuit simulator. And if you need even more speed you can add one or both of our hardware accelerators that use NVIDIA GPU cards (W2500) and compute clusters (W2312).

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