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Electronic Measurement

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Bottom Line: Support Contracts Save Money
PCB PULSE ARTICLE: You can avoid costly shutdowns, improve mean-time-to-repair, and get other provable bottom-line benefits with a support contract from Agilent. These contracts save money and improve profitability.

Feature Story 2003-06-20

SJ50 Series II Launched
PCB PULSE ARTICLE: On April 1, 2003, Agilent introduced the SJ50 Series II with Solid Shape Modeling (SSM), a technology breakthrough that would provide the industry's highest AOI call accuracy as well as a dramatic reduction in time-to-repair.

Feature Story 2003-06-20

NEMI Test Strategy Project Shows Results
PCB PULSE ARTICLE: The National Electronics Manufacturing Initiative (NEMI) Test Strategy project produced a new Test Strategy Cost Model and presented the results of a Test Coverage Analysis Study at APEX 2003.

Feature Story 2003-06-20

Agilent Solutions Knowledge Base
PCB PULSE ARTICLE: If you have an Internet connection and support contract, then Agilent expertise is literally as close as your keyboard.

Feature Story 2003-06-20

3D Inline SPI
PCB PULSE ARTICLE: Solder paste printing can account for up to 80 percent of all board defects. A new article by Stacy Kalisz Johnson describes how the Agilent SP50 hits that big target at two assembly houses that test fine pitch devices.

Feature Story 2003-06-20

Vectorless Test: New and Improved
PCB PULSE ARTICLE: Vectorless test just got better. Vectorless Test EP delivers dramatic unpowered test coverage improvements for BGAs, micro-BGAs and SMT connectors, and fully automates the test debug process.

Feature Story 2003-06-20

Time to Upgrade?
PCB PULSE ARTICLE: If you recently received a letter stating that your older Agilent equipment is entering a critical stage in the support lifecycle, it's time to evaluate your support needs and upgrade options.

Feature Story 2003-06-20

High availability for CompactPCI servers
Applied Computing Technologies article about CompactPCI

Feature Story 2001-03-19

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