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Announcing Industry's First Compliance Test Suite for Computer and Embedded DDR/2/3/4 and LPDDR/2/3
Agilent's First Compliance Test Suite for Computer and Embedded DDR/2/3/4 and LPDDR/2/3 Memory Applications.

新聞資料 2012-09-21

Agilent Technologies and CATR (TMC) to Collaborate on TD-LTE MIMO
Agilent Technologies Inc. (NYSE: A) announced a memorandum of understanding has been signed with the China Academy of Telecommunication Research (Telecommunication Metrology Center), or CATR (TMC). The two organizations have agreed to work together on TD-LTE MIMO over-the-air (OTA) test research.

新聞資料 2012-09-13

STATS ChipPAC Launches QFN Package Design Kit for Agilent Technologies’ Advanced Design System
STATS ChipPAC announces the launch of its Quad Flat No-Lead (QFN) package design kit for ADS.

新聞資料 2012-09-12

Agilent Technologies to Showcase High-Performance 32-Gb/s Bit Error Ratio Tester at ECOC
The Agilent N4960A 32-Gb/s BERT offers high-performance receiver testing beyond 28 Gb/s at a new level of affordability," said Juergen Beck, general manager of Agilent's Digital Photonic Test Division. "This and some other new products round out our portfolio of BERT instruments, covering all applications from cost-sensitive production test to the highest performance instruments needed for advanced research.

新聞資料 2012-09-11

Agilent Introduces 14 FieldFox Handheld Analyzers - Deliver Benchtop Accuracy, MIL-spec Durability

新聞資料 2012-08-31

Zuken Announces Enhanced Integration of Board Designer with Advanced Design System
Zuken, a leader in PCB Systems and IC Package design, announces enhancements to its integration between Zuken’s Board Designer solution and Agilent's Advanced Design System (ADS) software.

新聞資料 2012-08-30

Agilent Technologies Ships New Software for Generating and Qualifying SPICE Models
Agilent today announced shipment of its first release of the industry-leading SPICE modeling tools it obtained through the acquisition of Accelicon Technologies in February.

新聞資料 2012-08-23

Agilent Technologies Announces Wireless Communications Test Set with Innovative Multiport Adapter
Agilent Technologies introduced the E6607B EXT wireless communications test set and companion E6617A multiport adapter. Optimized for non-signaling testing, the EXT/MPA combination increases test throughput and reduces the cost of test in the manufacturing of current- and next-generation smartphones and tablets that contain multiformat and multiband technologies.

新聞資料 2012-08-01

Agilent to Demonstrate Test Solutions at International Symposium on Electromagnetic Compatibility
Agilent will demonstrate its test solutions at the IEEE International Symposium on Electromagnetic Compatibility in Pittsburg, Aug. 5-10, 2012.

新聞資料 2012-07-18

Introducing SerialTek BusXpert PRO II 12G SAS/SATA Analyzers
Identify potential data storage issues early in the design cycle to get products to market faster.

新聞資料 2012-07-18

Agilent to Acquire AT4 Wireless' Test Systems Business
Press Release

新聞資料 2012-07-16

Aldec and Agilent Technologies Bridge the Gap Between ESL and RTL by Linking Simulation Environments
This new solution enables users to efficiently integrate algorithm and system-level designs with hardware implementations.

新聞資料 2012-07-10

Agilent Technologies Collaborates with Thales to Apply X-parameters* Technology to RF System Design
Agilent announces that its ongoing collaboration with Thales, a global technology leader for the defense and security and the aerospace and transport markets, has expanded the reach of X-parameters technology to wideband super-heterodyne receiver applications.

新聞資料 2012-06-20

Agilent Extends Partnership with AMCAD to Include Nonlinear Modeling and Measurement Services
Agilent announces that its long-term relationship with AMCAD Engineering has been extended to include a technology partnership for services related to nonlinear design and measurement of new electronic devices.

新聞資料 2012-06-19

Advanced Design System Selected by Sivers IMA for Front-to-Back Silicon RFIC Implementation
Agilent announces that Sivers IMA, a leading European manufacturer of microwave products for telecommunications, industrial, and test and measurement applications, has selected ADS 2011 EDA platform for complete silicon-based RFIC/MMIC implementation.

新聞資料 2012-06-19

IBM adds back-end PDK support for Agilent Technologies’ Advanced Design System Software
IBM announces the availability of a full front-to-back PDK for its popular SiGe BiCMOS 8HP technology. The PDK was developed for use with ADS 2011 and enables both IBM and Agilent customers to take full advantage of the industry’s most comprehensive RF and microwave design platform.

新聞資料 2012-06-18

ON Semiconductor Offers High-Q™ IPD Process Design Kit for Advanced Design System Software
ON Semiconductor Corporation, a premier supplier of high performance silicon solutions for energy efficient electronics, announces the availability of a full front-to-back process design kit (PDK) for its High-Q™ Integrated Passive Device process. The PDK was developed for use with Agilent Technologies’ Advanced Design System (ADS) 2011 EDA software and enables both ON Semiconductor and Agilent customers to take full advantage of the industry’s most comprehensive RF and microwave design platform.

新聞資料 2012-06-18

Agilent Debuts Breakthroughs in Power Amplifier Module Design for Next Release of ADS
Agilent unveiled new technologies and breakthroughs for RF power amplifier design. These capabilities and more will be part of the next major release of Agilent's flagship Advanced Design System.

新聞資料 2012-06-13

Agilent Technologies' Newest 3D-EM Software Release Increases Integration with Circuit Design Flow
Agilent announced the latest release of its Electromagnetic Professional software. EMPro 2012 will make it easier to create 3-D models and analyze the electrical performance of packages, connectors, antennas, and other RF and high-speed components.

新聞資料 2012-06-12

Deep Memory and Raw Data Views Give Unprecedented Insight into Demanding CSI-2/DSI Designs

新聞資料 2012-06-12

Agilent Technologies Accelerates Early Wireless Design Verification with New Release of SystemVue
Agilent announces a new release of SystemVue, Agilent’s premier platform for designing communications systems.

新聞資料 2012-06-05

Agilent Technologies Accelerates Early Wireless Design Verification with New Release of SystemVue
Agilent will demonstrate SystemVue 2012.06 along with a range of solutions for everything from circuit-level modeling through system verification for general RF, microwave, 4G communications, and aerospace/defense applications at DAC2012 (Booth 313), June 3-7, in San Francisco. SystemVue 2012.06 will also be demonstrated at IMS 2012/IEEE MTT-S (Booth 1015), June 19-21, in Montr al, Canada. A range of premier partner solutions will be available on Agilent Avenue and throughout the event area.

新聞資料 2012-06-05

Agilent to Demonstrate Its Newest RF/Microwave Design and Test Products at IMS
Agilent will demonstrate its newest design and test products for advanced RF and microwave research, development and manufacturing at the 2012 IEEE MTT-S International Microwave Symposium (Booth 1015), June 17-22, at the Palais des congrès de Montréal.

新聞資料 2012-06-04

Agilent Technologies' Newest GoldenGate Software Release Accelerates Design Verification
Agilent announced the latest release of its RFIC simulation, verification and analysis software, GoldenGate 2012.

新聞資料 2012-06-04

GLOBALFOUNDRIES Qualifying GoldenGate and Momentum Simulators for its RF CMOS Processes
GLOBALFOUNDRIES announces support for Agilent's GoldenGate RFIC circuit and Momentum 3D planar electromagnetic (EM) simulators for its 65nm Low Power enhanced (LPe) RF CMOS process.

新聞資料 2012-06-04

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