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Solution Partner Newsletter Q2 2017
Solution Partner Newsletter Q2 2017

内部通讯 2017-05-26

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The Melting Trace Paradox
Unlike other famous paradoxes such as the Zeno’s paradox, where Achilles and the Tortoise are involved, the melting trace paradox is one with a segment of copper trace and a current source.

文章 2017-05-24

是德科技相位噪声、幅度和 TOI 测量误差
是德科技相位噪声、幅度和 TOI 测量误差

文章 2017-05-23

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Early Design Review or Boundary Scan in Enhancing Testability and Optimazation of Test Strategy
With complexities of PCB design scaling and manufacturing processes adopting to environmentally friendly practices raise challenges in ensuring structural quality of PCBs.

文章 2017-05-08

PDF PDF 624 KB
SRAM Cell Model Generation and Modeling Efficiency Take Center Stage in New Software Releases
Accurate and efficient modeling is critical to successful design, especially when it comes to the Static Random Access Memory (SRAM) cell, the minimum geometry devices in integrated circuit technology.

文章 2017-05-04

Villanova Professor and Students “Bang Heads” for Nanotechnology Research
Dr. Gang Feng, Associate Professor in the Department of Mechanical Engineering at Villanova University, is using advanced materials measurement technology to understand concussions, energy storage, and more.

文章 2017-04-21

Keysight EEsof EDA Newsletter - Product and Application News
Keep tabs on the latest product and application news and review the archives of the Keysight EEsof EDA Newsletter.

内部通讯 2017-04-04

Expanding IEEE Std 1149.1 Boundary-Scan Architecture Beyond Manufacturing Test of PCBA
This paper will discuss the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects on a components/devices in a Printed Circuit Board Assembly (PCBA)

文章 2017-04-01

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是德科技 Thales Nederland 公司受益于是德科技现场校准服务
是德科技 Thales Nederland 公司受益于是德科技现场校准服务

案例分析 2017-03-21

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STMicroelectronics and University of Lyon Predict EMI Using ADS - Case Study
Learn how STMicroelectronics and University of Lyon designers used ADS to develop a network parameter block technique to satisfy their need for accurate and general EMI modeling.

案例分析 2017-03-17

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Ensuring High Signal Quality in PCIe Gen3 Channels
This Signal Integrity Journal article written by Keysight engineer, Anil Kumar Pandey includes the challenges of maintaining transmission channel signal quality in today's PCIe Gen3 Channels.

文章 2017-03-14

Internet of Things (IoT) Teaching Solution – IoT Fundamentals

文章 2017-03-14

Internet of Things (IoT) Teaching Solution – IoT Systems Design

文章 2017-03-14

Keysight Translator for QDART Test
Keysight Translator software for QDART

文章 2017-03-09

Accurate Statistical-Based DDR4 Margin Estimation Using SSN Induced Jitter Model
This paper proposes a methodology, that improves the accuracy of DDR4 statistical simulation, by using the mask correction factor.

期刊 2017-03-04

是德科技通过战略资产管理降低测试成本
是德科技通过战略资产管理降低测试成本

文章 2017-03-02

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Heidi Barnes: DesignCon 2017 Engineer of the Year
EDN Network's Martin Rowe interviews Heidi Barnes, DesignCon 2017 Engineer of the Year.

文章 2017-02-23

为何需要器件建模服务?
IC 设计以器件建模和表征为基础。

文章 2017-02-03

IEEE 802.11™:无线局域网
通过 IEEE-SA、行业和政府支持,精选的 IEEE 标准可以免费下载。

案例分析 2017-02-03

Addressing The Challenges Facing IoT Adoption - Article Reprint
Addressing The Challenges Facing IoT Adoption - Article Reprint

文章 2017-01-23

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Transconductance Modeling for Low-Power Design
Raj Sodhi explains how to extract Gm near Vth using Keysight’s Model Builder Program (MBP) in 3 simple steps.

期刊 2017-01-18

Device Modeling 101 - What are Ft and Fmax?
Ft and Fmax are figures of merit used to benchmark the high frequency performance of RF transistors. This blog post describes the equations for these 2 parameters and how to improve the performance of RF transistors.

期刊 2016-12-18

Keysight One-Stop Calibration Capabilities – Americas
View our capabilities for dimensional / optical; electrical – DC, low frequency; electrical – optical; electrical – RF, microwave, millimeter wave; physical / mechanical

文章 2016-12-15

HUAWEI demonstrates 112 Gb/s PAM-4 optical signal transmission with M8196A AWG
112 Gb/s PAM-4 Optical Signal Transmission over 100-m OM4 Multimode Fiber for High-Capacity Data-Center

文章 2016-12-05

Integrating Multiple Technology Devices onto Laminate-Based Multi-Chip-Modules
Microwave Product Digest (MPD) featured article on "Integrating Multiple Technology Devices onto Laminate-Based Multi-Chip-Modules Using an Integrated Design Flow", written by Keefe Bohanan, Applications Engineer District Manager for Keysight EEsof EDA.

文章 2016-11-29

PDF PDF 3.90 MB

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