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476-500 of 679

Solid Shape Modeling - Working Towards 3-D AOI
Written by Xuemei Zhang and Gareth Bradshaw, Agilent Technologies. Published in Surface Mount Technology magazine, November 2004.

Article 2004-11-01

Controlling PB-Free Processes Through AOI
Written by Thorsten Niermeyer, Agilent Technologies. Article and cover published in Circuits Assembly, October 2004.

Article 2004-10-01

3D Techniques in SMT Test
By Malachy Rice, Ph.D, Stacy Johnson and Glen Leinbach, Agilent Technologies. Published by EE - Evaluation Engineering, February 2004.

Article 2004-09-28

WiMAX™: The Next Generation of Broadband Wireless Access
Article reprint from Electronics in Canada. This article provides anoverview of the 802.16 standard, theWiMAX forum, and key applications.

Article 2004-09-01

Effective cascaded intermodulation analysis
This article describes a new simulation technique that empowers designers to maximize intermodulation and noise performance while reducing analysis time.

Article 2004-09-01

Signal Integrity Analysis and Simulation Tools include IBIS Models
This Article describes the types of models that need to be taken together for high-speed signal integrity analysis, and illustrates their use in a simulation of a high-speed memory circuit.

Article 2004-09-01

Lead-free solder C&A panel for the 5DX Automated X-ray Inspection System
Lead-free alloys have different composition than tin-lead alloys. The Agilent 5DX Automated X-ray Inspection Systems compensates for the physical differences with a new confirmation and adjustment (C&A) panel.

Feature Story 2004-08-18

New Support Life summary online
PCB PULSE ARTICLE: Every six months, Agilent provides a summary of products that have reached or are approaching end of support (EOS). It's our way of helping you plan ahead, so your test strategy continues to keep pace with your business needs.

Feature Story 2004-08-18

3070 codeword conversion deadline looms
PCB PULSE ARTICLE: The end of the year will be here before you know it, and so will the deadline for updating 3070 codewords with valid license keys. Take care of it before midnight, December 31, to protect your rights.

Feature Story 2004-08-18

Consolidated Automated Support System (CASS) - Case Study
Electronic Functional Test of the Consolidated Automated Support System (CASS)

Case Study 2004-07-29

Keysight E2920 PCI Series: Verification Tools help Altera - Case Study
See how Keysight's E2920 Verification Tools, PCI Series helped Altera Cooperation get a competitive advantage

Case Study 2004-07-15

Keysight E2920 PCI Series: HP HSTC speeds High End Server Testing and reduces Engineering Costs
HP HSTC speeds High End Server Testing and reduces Engineering Costs with Keysight E2920 PCI Series

Case Study 2004-07-14

Keysight E2920 PCI Series: HP NSD stabilizes Server Designs quickly and completely with the...
One method NSD uses to accelerate development is to apply the Keysight E2920 PCI Series of Verification Tools to bring up, debug, and validate its PCI-based designs early in the process.

Case Study 2004-07-14

New AOI Software 4.09 Now Available
PCB PULSE ARTICLE: Agilent AOI software version 4.09 includes a number of new programming tools and algorithms to enhance performance of Agilent AOI systems while simplifying set-up and test program tuning.

Feature Story 2004-06-18

3070 Dual Controller Service
PCB PULSE ARTICLE: Your 3070 can now speak two languages - UNIX and Windows - making the transition to Windows-based test easier than ever.

Feature Story 2004-06-18

In-System Device Programming for 3070
PCB PULSE ARTICLE: The Agilent MCU Programming Package allows you to program parts at ultra-high speeds right on your Agilent 3070.

Feature Story 2004-06-18

Solutions Knowledge Base Online
Have you ever wished you could tap a colleagues brain to solve a specific test problem on your Agilent system? Here's your chance.

Feature Story 2004-06-18

Utilizing VEE for Data Collection in Surface and Undersea Research
Utilizing VEE for Data Collection in Surface and Undersea Research

Case Study 2004-05-27

Pins Test Detects Bondwire Failures
Recently, a high volume 3070 user came across a batch of devices with bad bondwires from the chip vendor. The symptom at ICT was failing "pins" tests (sometimes known as "Chek-Point").

Case Study 2004-05-26

Characterizing an OEM power supply using a 34970A Demo
This 2:30 minute video demonstrates a 34970A Data Acquisition / Switch Unit characterizing an OEM power supply.

Case Study 2004-05-06

CAMCAD Professional 4.3.x now available
PCB PULSE ARTICLE: If you use CAMCAD Professional software and you're on a software update service contract with Agilent, you can now upgrade to version 4.3.x.

Feature Story 2004-04-16

Instant Help, Fast Resolution
PCB PULSE ARTICLE: Flexible support has long been a selling point for Agilent customers. A prime example is Remote Assisted Support Using WebEx.

Feature Story 2004-04-16

3D SPI takes shape with SSM
PCB PULSE ARTICLE: A picture is worth a thousand words. It's especially true when using 3D Solid Shape Modeling (SSM) technology to get a clear visual representation of defects on surface mount assemblies.

Feature Story 2004-04-16

Linearizing PAs using Digital Predistortion, EDA Tools and Test Hardware
This Article describes the process for developing and implementing an effective power amplifier linearization scheme using baseband adaptive digital pre-distortion.

Article 2004-04-01

Broadband Monolithic S-band Class-E power Amplifier Design
This Article written by Reza Tayrani describes broadband monolithic S-band class-E power amplifier design in detail.

Article 2004-04-01


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