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Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing
This is a paper on 01005 Lead-Free Passive Assembly reprinted from IPC

Article 2007-03-01

PDF PDF 759 KB
Wideband Article in T&M World
.pdf file Technology Leader Series

Article 2007-02-26

PDF PDF 1.15 MB
Order Analysis of Rotating Machinery
This article from Realtime Update, Fall 1996 - Winter 1997, Hewlett-Packard, explains that analyzing the health and behavior of rotating machinery is a key application for dynamic signal analyzers (DSAs). Rotating machines produce repetitive vibrations and acoustic signals related to rotational...

Article 2007-02-22

PDF PDF 538 KB
A Refresher Course on Windowing and Measurements
In these days of digital instrumentation and PCs, it is easy to forget that physical phenomena are analog and that windows are not always operating systems. Windowing and digitization meet in the process of dynamic signal analysis. This Realtime Update article, Fall 1995 - Winter 1996, Hewlett...

Article 2007-02-22

PDF PDF 90 KB
Agilent Measurement Journal, Issue 1, February 2007
Agilent Measurement Journal is a technical publication created by Agilent Technologies to address the needs of today's test and measurement engineers.

Journal 2007-01-15

PDF PDF 4.81 MB
Phase Noise of PLL Functional Blocks in 0.35 μm SiGe Technology - Simulation Results
This brief Article presents results obtained from simulation for the phase noise in a PLL used for a 6.525 GHz fixed frequency source circuit. The simulation was done by using Agilent's ADS.

Article 2006-12-01

PDF PDF 178 KB
Efficere Technologies Develops World Class Test Fixtures
Read about Efficere’s design success using Keysight’s PLTS software, E8364B PNA and N1930A test set

Case Study 2006-11-29

PDF PDF 297 KB
Textron Systems has developed improved ATE Systems using the N6700 Modular Power System

Case Study 2006-11-21

PDF PDF 223 KB
Agilent Technologies Logic Analyzers Introduces Deepest Memory

Feature Story 2006-11-01

PDF PDF 26 KB
Complete RFIC Design Flow Targeting Next Generation Wireless Front-ends
This Article (by Jurgen Hartung Cadence Design Systems) presents a complete design flow that is crucial for a successful implementation of next generation wireless front-ends.

Article 2006-11-01

PDF PDF 218 KB
Flexible Software-Defined Test Instruments
This Article by Greg Jue presents the next generation of software defined test instruments; a key element in cost control, time to market, design flexibility and standards evolution.

Article 2006-11-01

PDF PDF 1.95 MB
Addressing the new challenges of MIMO wireless LAN manufacturing test
Article reprint from RF Design. New test equipment and techniques can keep the testing costs within the range of that for 802.11a/g systems.

Article 2006-10-01

PDF PDF 1.18 MB
Systematic Troubleshooting of HSDPA Mobile Data Throughput
The aim of this paper is to introduce mobile development engineers to factors impacting data throughput caused by actual customer connections of the mobile device.

Article 2006-09-28

HTML HTML 27 KB
Design Analysis: The Importance of EDA Post Processing
This Article by Andy Howard covers features and capabilities of a post processor that are present in a world-class EDA software package, and also includes many examples.

Article 2006-09-25

PDF PDF 2.21 MB
Test Sets Refine Handset Entertainment
Gaming and multimedia applications challenge testing to be more accurate, consistent, and capable of being reproduced among vendors. Wireless Systems article March 2004. Jan Schiefer.

Article 2006-09-22

Coverage Increased on Through-Hole Components Using PTH2 Algorithm
The 5DX Automated X-ray Inspection plated through hole algorithm, PTH2, provides an increase in accuracy along with repeatability for heavily shaded devices.

Newsletter 2006-09-08

Characterization and Modeling of Bond Wires for High-Frequency Applications
This Article presents a technique to compensate the bond-wire interconnect between two microstrip circuits to give return and insertion loss performance up to 50 GHz using circuit spacing’s/layouts.

Article 2006-09-01

PDF PDF 384 KB
EE Times: Reducing the cost of cellphone testing
With the explosive growth of worldwide mobile phone subscribers in emerging markets such as China and India, all manufacturers feel extreme pressure to reduce costs. Read more in this EE Times article from Sept. 2006 by Agilent employee Dan Aubertin.

Feature Story 2006-09-01

Quick ACPR Analysis Performs Necessary PA Simulations
This article describes a fast method of simulating Adjacent Channel Power Ratio (ACPR) versus input (or output) power level, based on a swept 1-tone harmonic balance simulation.

Journal 2006-07-01

Logic Analysis Application Suite targets High-Speed FPGA, Wireless and Multilane Serial Applications

Feature Story 2006-05-31

PDF PDF 27 KB
Agilent Technologies, Inc. introduces Industry’s Most Advanced Fixed Configuration Logic Analyzers

Feature Story 2006-05-31

PDF PDF 27 KB
10 Good Reasons to Use LXI
10 Reasons to Switch to LXI is the second in a series of notes that will help you make the transition to LXI. This note describes 10 key attributes that make LXI a good choice for your next test system.

Article 2006-04-01

PDF PDF 1.22 MB
Agilent Technologies Logic Analyzers and FuturePlus Systems team up

Feature Story 2006-02-21

PDF PDF 25 KB
CO-DESIGNS’ EDA Vendors guidelines for IC-PACKAGE Designers for effective work
This Article describes CO-DESIGNS’ EDA vendors guidelines for IC and PACKAGE designers on how to work effectively together.

Article 2006-02-02

PDF PDF 257 KB
Shotgunning: Not for Pb-Free - A proper test approach can reduce scrap from random repair methods.
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, November 2005.

Article 2005-12-05

PDF PDF 57 KB

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