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安捷倫 PCBA 測試得獎里程碑

專題報導 2013-12-15

安捷倫的教育新聞
安捷倫的教育新聞

專題報導 2012-12-10

Ball Grid Array Joint Inspection Using X-ray as it relates to voids and the IPC-7095A specification
With the introduction of Lead-free solder, voiding within Ball Grid Array (BGA) joints is potentially a major issue. This article discusses the relationship to voiding, the IPC standard and Automated X-ray Inspection.

專題報導 2012-12-06

PDF PDF 105 KB
NASA Tech Brief Article: Software Defined Instruments Address Mixed-Signal Test Challenges of Today
Software Defined Instruments Address Mixed-Signal Test Challenges of Today.

專題報導 2012-07-13

Agilent PCBA Test Award - 得獎里程碑

專題報導 2012-04-20

High-Speed Data Throughput Test
Ensure a quality user experience by fully testing the packet data performance of your wireless device early in the design cycle. The 8960 offers the highest 2G/3G/3.5G data rates and real-world testing to find issues sooner and resolve them faster!

專題報導 2011-11-29

Ultra-wideband radar system design article in EE Times

專題報導 2011-07-27

Wideband Radar + SATCOM Measurements
Growing trends in SATCOM and radar systems in the A/D market.

專題報導 2011-01-12

8PSK Modulation Accuracy Measurement Graphics

專題報導 2010-10-12

Defining a New Methodology for Radar System Design
Article from Microwave Product Digest, October 2010, discussing the use of analysis suites for the design of advanced digital signal processing techniques.

專題報導 2010-10-01

Real-World Battery Drain Analysis
Go beyond Talk Time Test! Test the battery life of your data device using realistic user scenarios to ensure real-world operation meets user expectations with the 8960, 14565B and IFT software.

專題報導 2010-08-30

i3070 重新安裝服務
i3070 重新安裝服務

專題報導 2010-05-25

Boundary Scan / JTAG
This article explains what boundary scan is and the role of the Joint Test Action Group, more commonly known as JTAG.

專題報導 2010-04-21

TestSight Developer
TestSight® Developer is the most cost effective CAD conversion solution in the market for Agilent Medalist i3070 and Medalist i1000.

專題報導 2010-01-22

Mentor Graphics Support of CAMCAD Pro - Letter
Letter: Agilent has decided to end its Reseller Contract with Mentor Graphics on Sales and Support of CAMCAD Pro to our customers. CAMCAD Pro converts CAD format to AOI, AXI and ICT input modules, and is a Mentor Graphics product.

專題報導 2010-01-07

PDF PDF 62 KB
ISO9000 certified repair centers for ICT and imaging inspection systems
ISO9000 certified repair centers for ICT and imaging inspection systems

專題報導 2009-11-16

Intellectual property and copyright protection on Agilent ICT products
This letter advises areas of intellectual property and copyright protection to look out for when customers elect to purchase Agilent in-circuit test products from third party vendors.

專題報導 2009-09-10

PDF PDF 111 KB
New Solutions Put Wireless To The Test
Pulbished with kind permission of Mobile Dev & Design

專題報導 2009-06-11

TD-LTE Technology And Its Measurements

專題報導 2009-05-14

PDF PDF 447 KB
In-Circuit Test Channel Partner Interview Series: Everett Charles Technology
The channel partners series began with an exploration of programming houses. It is not that we venture into the Fixture house side of the business. Please enjoy this extension of the article series.

專題報導 2009-03-10

PDF PDF 94 KB
In-Circuit Test Channel Partner Interview Series: QXQ, Inc.
This article is continues to educate on fixture houses in relation to in-circuit test as the article series explores fixturing houses that Agilent works regularly with. This article features QXQ, Inc.

專題報導 2009-03-04

PDF PDF 94 KB
In-Circuit Test Channel Partner Interview Series: TestingHouse Inc.
his article is the fourth in the series of education pieces relating to in-circuit test programming houses that Agilent works regularly with. This article features TestingHouse Inc., from a programming house perspective.

專題報導 2009-03-03

PDF PDF 95 KB
In-Circuit Test Channel Partner Interview Series: Circuit Check, Inc.
Circuit Check, Inc. provides comment in the editorial series serving to educate our in-circuit test contacts about the variety of fixture houses that Agilent has partnerships with.

專題報導 2009-02-28

PDF PDF 91 KB
Volumetric Paste Measurement using Solder Paste Inspection (SPI)
Written by : Jeff Bishop, Product Marketing Engineer, Agilent Technologies. The online recording discusses the techniques used for 3D paste analysis, accuracy of the measurements, and how these tools can be integrated into production affectively.

專題報導 2009-01-20

In-Circuit Test Channel Partner Interview Series: Masterpiece Engineering
This article is the third in the series of education pieces relating to in-circuit test programming houses that Agilent works regularly with. This article features Masterpiece Engineering, from a programming house perspective.

專題報導 2008-12-16

PDF PDF 106 KB

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