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Solid Shape Modeling - Working Towards 3-D AOI
Written by Xuemei Zhang and Gareth Bradshaw, Agilent Technologies. Published in Surface Mount Technology magazine, November 2004.

專文 2004-11-01

Using AOI to Verify IPC Compliance
Written by Malachy Rice, Ph.D, Agilent Technologies. Appeared in Machine Vision supplement of Test & Measurement World, November 2004.

專文 2004-11-01

Controlling PB-Free Processes Through AOI
Written by Thorsten Niermeyer, Agilent Technologies. Article and cover published in Circuits Assembly, October 2004.

專文 2004-10-01

3D Techniques in SMT Test
By Malachy Rice, Ph.D, Stacy Johnson and Glen Leinbach, Agilent Technologies. Published by EE - Evaluation Engineering, February 2004.

專文 2004-09-28

Utilizing VEE for Data Collection in Surface and Undersea Research
Utilizing VEE for Data Collection in Surface and Undersea Research

案例研究 2004-05-27

PDF PDF 130 KB
Pins Test Detects Bondwire Failures
Recently, a high volume 3070 user came across a batch of devices with bad bondwires from the chip vendor. The symptom at ICT was failing "pins" tests (sometimes known as "Chek-Point").

案例研究 2004-05-26

PDF PDF 53 KB
Vectorless Test EP (VTEP) Goes Head-to-Head with Keysight TestJet - Case Study
VTEP has proven its abilities to improve in-circuit test coverage by over 80 percent compared to the older TestJet technology, especially on boards with hard-to-test packages such as BGAs, micro-BGAs, and SMT edge connectors.

案例研究 2003-12-16

PDF PDF 1.36 MB
Selcom Group Uses Integrated Test to Cut Costs and Increase Business
Selcom Group uses a combination of test technologies from Keysight to meet stringent cost, quality, and shipping targets, allowing Selcom to continue growing and thriving in a difficult worldwide economy.

案例研究 2003-10-24

PDF PDF 600 KB
Step-by-Step Series: Step 9 -Test and Inspection
Written by Stig Oresjo, Agilent Technologies. Published in SMT, October 2003.

專文 2003-10-01

Keysight Quality Tool Testimonials
Learn what users have to say about Keysight Quality Tool.

案例研究 2003-09-30

ScanWorks Reduces Vivace Networks' ICT Costs and Improves Board Quality
This paper discusses how Vivace Networks uses ScanWorks at the benchtop and at in-circuit test to reduce test costs and accelerate time to market in a competitive environment.

案例研究 2003-07-31

PDF PDF 29 KB
Lucent Demonstrates how ScanWorks for the Keysight 3070 Can Save Nearly $1 Million Per Year
Lucent has demonstrated that reusing ScanWorks boundary-scan tests on the 3070 ICT platform can produce dramatic cost savings through lower test development and fixture costs without giving up test coverage.

案例研究 2003-07-23

PDF PDF 222 KB
Selecting the Optimal Test Strategy
Written by Stig Oresjo, Agilent Technologies. Published in Circuits Assembly, July 2003.

專文 2003-07-01

3D Inline SPI
PCB PULSE ARTICLE: Solder paste printing can account for up to 80 percent of all board defects. A new article by Stacy Kalisz Johnson describes how the Agilent SP50 hits that big target at two assembly houses that test fine pitch devices.

專題報導 2003-06-20

Motorola Drives Reliability and Productivity of In-Car Safety Systems with the Keysight 3070
To maintain rigorous testing without hindering assembly line productivity, Motorola chose the Keysight 3070 In-circuit Test System.

案例研究 2003-06-03

PDF PDF 2.01 MB
ScanWorks Completes Successful Assessment at Jabil Circuit
One of the first places electronics manufacturers look to reduce expenses is through the elimination of redundant effort.

案例研究 2003-03-21

PDF PDF 661 KB
AwareTest xi Case Study #3
This case study compares fault coverage of the current test strategy (automatic optical inspection/full in-circuit test) with a combined x-ray inspection/simplified in-circuit test strategy.

案例研究 2003-02-15

PDF PDF 164 KB
AwareTest xi Case Study #2
This case study compares the current test strategy with a full combined test strategy and a simplified combined test strategy (x-ray inspection followed by simplified in-circuit test).

案例研究 2003-02-15

PDF PDF 763 KB
AwareTest xi Case Study #1
This case study compares a fully-probed in-circuit test on a conventional high node count test system with a combined x-ray/in-circuit test strategy, using the simplified in-circuit test.

案例研究 2003-02-15

PDF PDF 127 KB
One Billion Solder Joints and Counting
Written by Stig Oresjo, Agilent Technologies. Published with permission from Circuits Assembly, February 2001.

專文 2003-02-01

PDF PDF 1.81 MB
Customer Testimonial for Keysight VEE Pro
Customer Testimonial for Keysight VEE Pro (3-minute video)

案例研究 2003-01-05

AMCC Achieves Performance Beyond SONET/SDH Requirements
A WAN system solution provider wins customers' loyalty by demonstrating jitter characteristics far beyond compliance.

案例研究 2002-09-19

PDF PDF 1.94 MB
Frank Beider, Norlight Telecommunications
"Through our solution, we gained customer goodwill. How can you put a price on that?"

案例研究 2002-08-19

Andy Gallacher, Hewlett Packard
"Used the Keysight Advisor to trap errors. Reconfigured the hosts for half duplex and the problem went away. I wouldn't have found this without the Advisor!!"

案例研究 2002-08-19

Daniel Moses, Test Technician
"The Keysight Advisor allowed simple and precise problem isolation that allowed us to quickly return to packet delivery rate of 100% with no errors."

案例研究 2002-08-19

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