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A Model-Based Automated Debug Process
Learn how Cisco Systems Inc. used Fault Detective on their high-end networking products.

案例研究 2007-03-01

PDF PDF 123 KB
A Refresher Course on Windowing and Measurements
In these days of digital instrumentation and PCs, it is easy to forget that physical phenomena are analog and that windows are not always operating systems. Windowing and digitization meet in the process of dynamic signal analysis. This Realtime Update article, Fall 1995 - Winter 1996, Hewlett...

專文 2007-02-22

PDF PDF 90 KB
Order Analysis of Rotating Machinery
This article from Realtime Update, Fall 1996 - Winter 1997, Hewlett-Packard, explains that analyzing the health and behavior of rotating machinery is a key application for dynamic signal analyzers (DSAs). Rotating machines produce repetitive vibrations and acoustic signals related to rotational...

專文 2007-02-22

PDF PDF 538 KB
Coverage Increased on Through-Hole Components Using PTH2 Algorithm
The 5DX Automated X-ray Inspection plated through hole algorithm, PTH2, provides an increase in accuracy along with repeatability for heavily shaded devices.

新聞簡訊 2006-09-08

Shotgunning: Not for Pb-Free - A proper test approach can reduce scrap from random repair methods.
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, November 2005.

專文 2005-12-05

PDF PDF 57 KB
Pb-Free’s Impacts on Test and Inspection
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, January 2005.

專文 2005-12-05

PDF PDF 75 KB
Pb-Free PCB Finishes for ICT - New solders can mean new finishes. How to decide which is best.
Written by Stig Oresjo and Chris Jacobsen, Agilent Technologies. Article published in Circuits Assembly, September 2005.

專文 2005-12-05

PDF PDF 88 KB
Overcoming Lower Wetting Forces of Lead-Free Alloys
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, March 2005.

專文 2005-12-05

PDF PDF 77 KB
Characterizing new soldering processes – An experimental methodology for process optimization
Written by Glen Leinbach and Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, July 2005

專文 2005-12-05

PDF PDF 65 KB
Putting Pb-Free to the Test - Why AOI and SPI are vital to upfront process control and verification.
Written by Stig Oresjo, Thorsten Niermeyer & Stacy Johnson, Agilent Technologies. Article published in Circuits Assembly, May 2005.

專文 2005-12-05

PDF PDF 74 KB
Fault Detective Case Study #1 Presentation
4 slide presentation that summarizes Keysight employing its test optimization software to improve the quality and yield of its RF printed circuit assemblies.

案例研究 2005-09-26

PDF PDF 72 KB
Be generous with tests (Slösa med testerna)
Written by Stig Oresjo, Agilent Technologies. This article discusses the use of AOI for success in lead-free since the lead-free process is less forgiving, than tin-lead. Note that the article is in Swedish.

專文 2005-08-31

用於材料特性分析的 VEE Pro
ONERA (法國) 使用寫入 VEE Pro 中的自動測試設定,分析太空國防材料的 EM 吸收與反射特性。

案例研究 2005-05-09

PDF PDF 591 KB
用於氣候模擬箱 (climatic chamber) 的自動測試 VEE Pro
ISSeP (比利時) 使用 VEE Pro 開發出自動系統,以分析氣候模擬箱、培養箱和冷凍裝置的特性。

案例研究 2005-05-09

PDF PDF 238 KB
Selcom Testimonial
Customer testimonial which discusses the advantages gained from using the Keysight Medalist Family of test and inspection systems.

案例研究 2005-03-14

WMF WMF 19.21 MB
AXI Conquers Hidden Joint Defects
Written by Jeremy Jessen, Agilent Technologies. Published In SMT magazine, February 2005.

專文 2005-02-01

PDF PDF 134 KB
Traceable Calibration for 3070
As test equipment ages, system performance degrades. Agilent can help protect your investment with NIST traceable system calibration.

專題報導 2004-12-13

Solid Shape Modeling - Working Towards 3-D AOI
Written by Xuemei Zhang and Gareth Bradshaw, Agilent Technologies. Published in Surface Mount Technology magazine, November 2004.

專文 2004-11-01

Using AOI to Verify IPC Compliance
Written by Malachy Rice, Ph.D, Agilent Technologies. Appeared in Machine Vision supplement of Test & Measurement World, November 2004.

專文 2004-11-01

Controlling PB-Free Processes Through AOI
Written by Thorsten Niermeyer, Agilent Technologies. Article and cover published in Circuits Assembly, October 2004.

專文 2004-10-01

3D Techniques in SMT Test
By Malachy Rice, Ph.D, Stacy Johnson and Glen Leinbach, Agilent Technologies. Published by EE - Evaluation Engineering, February 2004.

專文 2004-09-28

Utilizing VEE for Data Collection in Surface and Undersea Research
Utilizing VEE for Data Collection in Surface and Undersea Research

案例研究 2004-05-27

PDF PDF 130 KB
Pins Test Detects Bondwire Failures
Recently, a high volume 3070 user came across a batch of devices with bad bondwires from the chip vendor. The symptom at ICT was failing "pins" tests (sometimes known as "Chek-Point").

案例研究 2004-05-26

PDF PDF 53 KB
Vectorless Test EP (VTEP) Goes Head-to-Head with Keysight TestJet - Case Study
VTEP has proven its abilities to improve in-circuit test coverage by over 80 percent compared to the older TestJet technology, especially on boards with hard-to-test packages such as BGAs, micro-BGAs, and SMT edge connectors.

案例研究 2003-12-16

PDF PDF 1.36 MB
Selcom Group Uses Integrated Test to Cut Costs and Increase Business
Selcom Group uses a combination of test technologies from Keysight to meet stringent cost, quality, and shipping targets, allowing Selcom to continue growing and thriving in a difficult worldwide economy.

案例研究 2003-10-24

PDF PDF 600 KB

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