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ADS 2013.06 Release Notes
Information about the ADS 2013.06 Release

Release Notes 2013-06-17

Multi-Chip Module assembly in ADS2012
Jack Sifri of Keysight Technologies demonstrates multi-chip module assembly in Keysight EEsof EDA's Advanced Design System.

Demo 2013-06-11

Agilent Introduces Electrical Retimer Solution to Solve Challenges in Designing Chip-to-Chip Links
Agilent introduces the latest addition to its repeater model library for quickly and accurately solving the challenge posed by signal distortion in the multigigabit-per-second regime.

Press Materials 2013-05-29

Agilent Technologies Announces High-Speed Digital Seminar Tour with Micron
Agilent announces its 2013 High-Speed Digital Tour, covering more than 20 locations throughout Europe.

Press Materials 2013-05-28

Agilent Technologies' Newest 3-D Electromagnetic Simulation Software Release Targets EMI Compliance
Agilent announces the latest release of Electromagnetic Professional (EMPro), its 3-D electromagnetic simulation software.

Press Materials 2013-05-28

Keysight Equipment Plays an Instrumental Role in Prototype Alternative Breast Imaging Technique

Article 2013-05-27

Agilent Technologies to Demonstrate Leading-Edge RF/MW Design and Test Solutions at IMS
Agilent will demonstrate 25 of its newest design and measurement solutions at the IEEE MTT-S International Microwave Symposium (Booth 1230), June 2-7, at the Washington State Convention Center in Seattle.

Press Materials 2013-05-21

Momentum Overview
Overview video of Keysight Momentum, the gold standard in 3D planar electromagnetic simulation that enables your design of optimum laminar structures.

Demo 2013-05-08

ClioSoft Announces the Integration of SOS Design Data Management with Advanced Design System
ClioSoft's integrated solution offers ADS users seamlessly integrated revision control and enterprise design data management

Press Materials 2013-05-07

EM Insights Series
The EM Insights series is a collection of EM applications from Keysight EEsof EDA.

Application Note 2013-05-06

Agilent to Demonstrate Latest RF Circuit, System and 3-D EM Design & Simulation Solutions at WAMICON
Agilent announces it will demonstrate its latest RF circuit, system and 3-D electromagnetic design and simulation solutions at the 14th annual IEEE Wireless and Microwave Technology Conference. WAMICON 2013 will be held April 7-9 at the Caribe Royale Hotel and Convention Center in Orlando, Fla.

Press Materials 2013-04-04

Agilent Technologies Simulation Software Selected by Plextek RF Integration
Agilent announces that Plextek RF Integration, a UK-based company that designs and develops RFICs, MMICs and microwave/millimeter-wave modules, has selected Agilent software to simulate its new high-frequency circuit and MMIC designs.

Press Materials 2013-03-27

A Packaged 60 GHz Low-Power Transceiver with Integrated Antennas for Short-Range Communications
This paper describes a 60-GHz transceiver with integrated antennas for short range and low power wireless communications fabricated in a CMOS 65nm SOI technology.

Article 2013-03-25

PDF PDF 429 KB
Agilent Technologies' EEsof YouTube Channel Passes Half-Million View Mark
Agilent announces that its Agilent EEsof EDA channel on YouTube has surpassed half a million views and 1,300 subscribers.

Press Materials 2013-03-20

Agilent Technologies Launches Recognition Program for EDA Experts
Agilent launches its Agilent Certified Expert recognition program for EDA experts. Eligible participants include individuals demonstrating a high level of expertise-both theoretical and practical-in applying Agilent EEsof EDA tools for product design and modeling.

Press Materials 2013-03-12

Agilent Technologies Helps Students Acquire Real-World EDA Skills with New Licensing Program
Agilent launches the Agilent EEsof EDA Student License Program, designed to provide access to Agilent EEsof EDA software on students’ personal computers.

Press Materials 2013-02-25

Equivalent Circuit Based Models For Surface Mount RLC Components
Modelithics white paper on understanding S-parameter versus equivalent circuit-based models for surface mount RFC components.

Application Note 2013-02-06

Agilent Technologies Commits $90 Million Gift of Software to Georgia Institute of Technology
Agilent announces the largest in-kind software donation ever in its longstanding relationship with the Georgia Institute of Technology.

Press Materials 2013-02-04

Designing Multiple-Throw Switches in a MMIC Configuration
A Chip Design article by P. Sreenivasa Rao, design flow verification expert at Agilent Technologies.

Article 2013-01-31

Keysight EEsof EDA License Configuration Guide
This guide provides an overview of Keysight EEsof EDA licensing options which can help a user choose the appropriate product and license configuration that best suits their needs.

Configuration Guide 2013-01-29

Agilent Technologies and SiSoft Introduce Pre-Standard IBIS-AMI Modeling Guide
Agilent and Signal Integrity Software, Inc. (SiSoft) announce guidelines that enable system designers to use advanced jitter and broadband analog capabilities when modeling high-speed serial devices.

Press Materials 2013-01-29

Agilent Technologies to Demonstrate Newest High-Speed Digital Design and Test Solutions at DesignCon
Agilent announces it will demonstrate its high-speed digital design and test solutions at DesignCon, Jan. 28- 31, at the Santa Clara Convention Center (Booth 201).

Press Materials 2013-01-15

ADS 2012 Help
Product-specific release information for Advanced Design System 2012.

Help File 2013-01-08

89601B/BN-105 Link to EEsof ADS/SystemVue, 89600 VSA Technical Overview
This technical overview integrates the 89600 VSA software with Keysight's EEsof Advanced Design System (ADS) electronic design automation software or SystemVue ESL software with Option 105.

Technical Overview 2012-12-19

PDF PDF 782 KB
Agilent Technologies Unveils New IC-CAP Platform for Device Characterization and Modeling
Agilent announces the latest release of its device modeling software platform, the Integrated Circuit Characterization and Analysis Program (IC-CAP).

Press Materials 2012-12-18

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