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Electronic Measurement

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Agilent Technologies Ships Newest EMPro Software Release for Analyzing 3-D Electromagnetic Effects
Agilent Technologies announces shipment of its EMPro 2012.09 3-D electromagnetic simulation software.

Press Materials 2012-11-15

Electrical Redriver Modeling Solution to Solve Key Challenges in Designing Chip-to-Chip Links
Agilent introduces a redriver modeling solution designed to quickly and accurately solve the challenge posed by signal distortion in multigigabit-per-second systems.

Press Materials 2012-11-05

Agilent Technologies to Demonstrate High-Speed Digital Design Solutions at EPEPS
Agilent announces it will demonstrate its high-speed digital design solutions at EPEPS 2013, Oct. Oct. 28 & 29, at the DoubleTree by Hilton Hotel in San Jose, Calif

Press Materials 2012-10-28

Agilent Technologies to Demonstrate Newest 3-D EM Software Release at European Microwave Week
Agilent announces that EMPro 2012 will be demonstrated at European Microwave Week (Booth 114), Oct. 29-Nov. 1, RAI, Amsterdam.

Press Materials 2012-10-23

Agilent to Demonstrate Newest Microwave and RF Design and Test Solutions at European Microwave Week
Agilent announces it will show its newest microwave and RF design, test and measurement solutions for the aerospace, defense, research, education, communications, transportation and medical markets at European Microwave Week (Booth 114), Oct. 29- 31, at the RAI convention center in Amsterdam.

Press Materials 2012-10-17

Murata Component Library released for Agilent Technologies' Genesys
Murata Manufacturing Co. Ltd. announces their release of a component library for Agilent's Genesys software.

Press Materials 2012-10-10

Agilent Technologies Unveils ADS 2012 Software
Agilent unveils ADS 2012, the next major release of its Advanced Design System (ADS) flagship RF and microwave EDA platform.

Press Materials 2012-10-03

Agilent's EMPro Selected by STMicroelectronics for ESD Development in 40-nm IC Products
Agilent announces that STMicroelectronics has selected EMPro software for use in development of ESD structures based on advanced CMOS process technology.

Press Materials 2012-10-02

STATS ChipPAC Launches QFN Package Design Kit for Agilent Technologies’ Advanced Design System
STATS ChipPAC announces the launch of its Quad Flat No-Lead (QFN) package design kit for ADS.

Press Materials 2012-09-12

Zuken Announces Enhanced Integration of Board Designer with Advanced Design System
Zuken, a leader in PCB Systems and IC Package design, announces enhancements to its integration between Zuken’s Board Designer solution and Agilent's Advanced Design System (ADS) software.

Press Materials 2012-08-30

Agilent Technologies Ships New Software for Generating and Qualifying SPICE Models
Agilent today announced shipment of its first release of the industry-leading SPICE modeling tools it obtained through the acquisition of Accelicon Technologies in February.

Press Materials 2012-08-23

Agilent to Demonstrate Test Solutions at International Symposium on Electromagnetic Compatibility
Agilent will demonstrate its test solutions at the IEEE International Symposium on Electromagnetic Compatibility in Pittsburg, Aug. 5-10, 2012.

Press Materials 2012-07-18

Aldec and Agilent Technologies Bridge the Gap Between ESL and RTL by Linking Simulation Environments
This new solution enables users to efficiently integrate algorithm and system-level designs with hardware implementations.

Press Materials 2012-07-10

Agilent Technologies Collaborates with Thales to Apply X-parameters* Technology to RF System Design
Agilent announces that its ongoing collaboration with Thales, a global technology leader for the defense and security and the aerospace and transport markets, has expanded the reach of X-parameters technology to wideband super-heterodyne receiver applications.

Press Materials 2012-06-20

Advanced Design System Selected by Sivers IMA for Front-to-Back Silicon RFIC Implementation
Agilent announces that Sivers IMA, a leading European manufacturer of microwave products for telecommunications, industrial, and test and measurement applications, has selected ADS 2011 EDA platform for complete silicon-based RFIC/MMIC implementation.

Press Materials 2012-06-19

Agilent Extends Partnership with AMCAD to Include Nonlinear Modeling and Measurement Services
Agilent announces that its long-term relationship with AMCAD Engineering has been extended to include a technology partnership for services related to nonlinear design and measurement of new electronic devices.

Press Materials 2012-06-19

IBM adds back-end PDK support for Agilent Technologies’ Advanced Design System Software
IBM announces the availability of a full front-to-back PDK for its popular SiGe BiCMOS 8HP technology. The PDK was developed for use with ADS 2011 and enables both IBM and Agilent customers to take full advantage of the industry’s most comprehensive RF and microwave design platform.

Press Materials 2012-06-18

ON Semiconductor Offers High-Q™ IPD Process Design Kit for Advanced Design System Software
ON Semiconductor Corporation, a premier supplier of high performance silicon solutions for energy efficient electronics, announces the availability of a full front-to-back process design kit (PDK) for its High-Q™ Integrated Passive Device process. The PDK was developed for use with Agilent Technologies’ Advanced Design System (ADS) 2011 EDA software and enables both ON Semiconductor and Agilent customers to take full advantage of the industry’s most comprehensive RF and microwave design platform.

Press Materials 2012-06-18

Agilent Debuts Breakthroughs in Power Amplifier Module Design for Next Release of ADS
Agilent unveiled new technologies and breakthroughs for RF power amplifier design. These capabilities and more will be part of the next major release of Agilent's flagship Advanced Design System.

Press Materials 2012-06-13

Agilent Technologies' Newest 3D-EM Software Release Increases Integration with Circuit Design Flow
Agilent announced the latest release of its Electromagnetic Professional software. EMPro 2012 will make it easier to create 3-D models and analyze the electrical performance of packages, connectors, antennas, and other RF and high-speed components.

Press Materials 2012-06-12

Agilent Technologies Accelerates Early Wireless Design Verification with New Release of SystemVue
Agilent announces a new release of SystemVue, Agilent’s premier platform for designing communications systems.

Press Materials 2012-06-05

GLOBALFOUNDRIES Qualifying GoldenGate and Momentum Simulators for its RF CMOS Processes
GLOBALFOUNDRIES announces support for Agilent's GoldenGate RFIC circuit and Momentum 3D planar electromagnetic (EM) simulators for its 65nm Low Power enhanced (LPe) RF CMOS process.

Press Materials 2012-06-04

X-FAB Qualifies GoldenGate and Momentum Simulators for its 0.35 Micrometer CMOS Process Family
X-FAB Silicon Foundries, a leading foundry group for analog/mixed-signal semiconductor applications, announces support for GoldenGate RFIC circuit and Momentum 3D planar EM simulators for X-FAB's 0.35 micrometer modular analog/mixed-signal technology with RF capability and high-voltage extensions.

Press Materials 2012-06-04

Agilent Technologies' Newest GoldenGate Software Release Accelerates Design Verification
Agilent announced the latest release of its RFIC simulation, verification and analysis software, GoldenGate 2012.

Press Materials 2012-06-04

Agilent to Demonstrate Its Newest RF/Microwave Design and Test Products at IMS
Agilent will demonstrate its newest design and test products for advanced RF and microwave research, development and manufacturing at the 2012 IEEE MTT-S International Microwave Symposium (Booth 1015), June 17-22, at the Palais des congrès de Montréal.

Press Materials 2012-06-04

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