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Keysight EEsof EDA Newsletter - Product and Application News
Keep tabs on the latest product and application news and review the archives of the Keysight EEsof EDA Newsletter.

Newsletter 2016-02-01

Minimizing Design Risk, Shortening Development Time of a Digital Transmission System
Powerful design and simulation software provides valuable insights to help uncover and solve difficult design challenges at every stage of the design process.

Case Study 2015-12-15

PDF PDF 1.17 MB
Using Automatic Synthesis of RF, Microwave & Analog Circuits to Increase Design Productivity by 10x
Microwave Product Digest's October 2015 Featured Article written by How-Siang Yap of Keysight Technologies.

Feature Story 2015-10-28

Wireless Power Transfer Efficiency Test with ENA Series Network Analyzers
Option 006 wireless power transfer analysis software in ENA Series network analyzers enable wireless power transfer efficiency measurements in real-time. Advanced 2D/3D simulation feature visualizes the dependency of load impedance.

Article 2015-09-27

Keysight EEsof EDA makes it easy to get back to school—at least virtually
Rick Nelson, executive editor of Evaluation Engineering, visited Keysight Technologies and had this to say about Keysight EEsof EDA.

Article 2015-09-11

Challenges extend from simulation to compliance
Tami Pippert, Keysight Technologies’ high-speed digital marketing program manager, elaborates on how Keysight is enhancing its model generation, simulation, and data analysis technologies.

Article 2015-07-08

Determining the Best RF Simulation Tools as an RF Consulting Engineer
Independent consulting in RF and microwave engineering is a growing trend and many engineers are delivering their highly sought after RF expertise back to the industry.

Article 2015-06-08

PDF PDF 2.64 MB
Faster Testing with High-Performance Spectrum Analysis in a VNA - Article Reprint
Article reprint from the June 2015 issue of Microwave Journal highlighting the new spectrum analyzer option for the PNA Series.

Article 2015-06-01

PDF PDF 1.23 MB
Improving IBIS-AMI Model Accuracy: Model-to-Model and Model-to-Lab Correlation Case Studies - Articl
This DesignCon 2014 paper presents case studies for model-to-model & model-to-lab correlation methods & compares favorable/unfavorable factors for both methods. 10G, 11.5G and 23G SerDes data are used as examples.

Article 2015-04-02

PDF PDF 3.34 MB
A Nonlinear Model Complier for RF/MICROWAVE Engineers
This Article presents Genesys latest release which includes a powerful Verilog-A compiler technology and hence enhancing the accuracy of simulation.

Article 2015-03-18

PDF PDF 545 KB
HeatWave Case Studies
HeatWave Electro-Thermal simulation case studies.

Case Study 2014-09-18

HeatWave Technical Papers
Links to various technical papers related to HeatWave Electro-Thermal analysis software.

Article 2014-08-27

IBIS AMI Modeling of Retimer and Performance Analysis of Retimer based Active Serial Links
This paper presents a novel retimer modeling approach based on IBIS-AMI to capture the performance of a retimer that operates up to 15 Gbps.

Article 2014-08-04

PDF PDF 1.88 MB
Mechanism of Jitter Amplification in Clock Channels
In this paper. jitter amplification in clock channels is analyzed analytically using the techniques developed in "Frequency domain analysis of jitter amplification in clock channels."

Article 2014-08-04

PDF PDF 715 KB
Touchstone v2.0 SI/PI S-Parameter Models for Simultaneous Switching Noise (SSN) Analysis of DDR4
This article reprint presents a methodology to setup and analyze Simultaneous Switching Noise for DDR4 applications using Touchstone v2.0 models.

Article 2014-08-04

PDF PDF 8.20 MB
Modeling, Extraction and Verification of VCSEL Model for Optical IBIS AMI
A technique of modeling and extraction of VCSEL devices for IBIS-AMI has been proposed.

Article 2014-08-04

PDF PDF 1.18 MB
De-Mystifying the 28 Gb/s PCB Channel: Design to Measurement
This paper demonstrates a design methodology for 28 Gb/s SERDES channels using Xilinx Virtex-7 Tx to show the required trade-offs that enable robust performance that is easy to verify with measurement.

Article 2014-08-04

PDF PDF 2.84 MB
FEM Modeling of Gigahertz TEM Cells for Susceptibility Analysis of RFID Products
This paper presents a novel simulation methodology to model the coupling between a GTEM cell and an RF-ID antenna.

Article 2014-08-03

PDF PDF 816 KB
Accurate Simulation Models Yield High-Efficiency Power Amplifier Design
This Article by Sonoko Akamatsu, Charles Baylis, and Larry Dunleavy details the design goals and simulation- based processes for Power Amplifier Design.

Article 2014-07-31

PDF PDF 592 KB
Using S-Parameter Data Effectively
This Article by Wilfredo Rivas-Torres focuses on how to incorporate Sparameters in the design process using a CAD approach.

Article 2014-07-31

PDF PDF 248 KB
Designing RFID Tags Using Direct Antenna Matching
This Article by Cory Edelman and Murthy Upmaka describes the design challenges involved in RFID design and also focuses on the use of integrated EDA tools to optimally address the challenges.

Article 2014-07-31

PDF PDF 1.09 MB
Digital Predistortion Linearizes Wireless Power Amplifiers
This Article by Wan-Jong Kim, Shawn P. Stapleton, Jong Heon Kim, and Cory Edelman focuses on how digital predistortion linearizes wireless power amplifiers.

Article 2014-07-31

PDF PDF 1.81 MB
Symmetric and Asymmetric - Coupled Lines Band-Stop Filters at Ku/Ka Bands
This Article presents theory and design of coupled-line spur line band-stop filters, which are quite compact structures, lower radiation loss than conventional shunt stub and coupled-line filters.

Article 2014-07-31

PDF PDF 1.38 MB
New LDMOS Model Delivers Powerful Transistor Library - Part 2
This article reprint presents that the CMC (LDMOS FET) model can be scaled for a larger device, with a good fit for signal, power and distortion performance as illustrated by a 60W Doherty PA design example.

Article 2014-07-31

PDF PDF 699 KB
RF SiP Design Verification Flow with Quadruple LO Down Converter SiP
This article reprint by HeeSoo Lee and Dean Nicholson outlines the design flow used for a System-in-Package component, using multiple die integrated into a single packaged device.

Article 2014-07-31

PDF PDF 505 KB

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