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In-circuit Test Systems - 3070 ICT

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Charting a DFT Course for Limited Access Boards
Written by Stig Oresjo and Barry Odbert. Published with permission from SMT Magazine, June 2002.

Article 2002-06-01

PDF PDF 143 KB
Notebook Manufacturer Finds Margins in the Details
Design-for-manufacturing methods and an automated test environment help FIC control costs, improve product quality, and protect its margins.

Case Study 2002-02-07

PDF PDF 457 KB
New Test Strategy for Tomorrow's Manufacturing
Written by Mark Terry, Agilent Technologies. Published with permission from Circuits Assembly, August 2000.

Article 2000-08-01

PDF PDF 119 KB
Complementary Test Strategies on High-Complexity Boards
Written by Amit Verma, Mark Ogden and John Kokoska, of Celestica Inc. Published with permission from Circuits Assembly, August 2000.

Article 2000-08-01

PDF PDF 92 KB
Streamlining Test For A Competitive Marketplace
The market price for telephones has dropped ten per-cent each year over the last ten years. To stay competitive, Landis & Gyr Communications, a manufacturer of public telephones, must produce reliable phones faster, with more features for less money.

Case Study 2000-04-01

PDF PDF 98 KB
In-Circuit Testing of High Node Count Boards--Bigger is Not Always Better
The in-circuit test (ICT) engineer faces serious financial and technical challenge when testing more than 3500 nodes.

Case Study 2000-02-01

PDF PDF 77 KB
Tackling Advanced Technology Boards: Combining X-ray and ICT
Written by By Ed Crane, Ed Kinney and Bill Jeffrey. Printed with permission from Circuits Assembly, September 1999.

Article 1999-09-01

PDF PDF 890 KB

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