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In-circuit Test Systems - 3070 ICT

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Pb-Free’s Impacts on Test and Inspection
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, January 2005.

Article 2005-12-05

PDF PDF 75 KB
Overcoming Lower Wetting Forces of Lead-Free Alloys
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, March 2005.

Article 2005-12-05

PDF PDF 77 KB
Characterizing new soldering processes – An experimental methodology for process optimization
Written by Glen Leinbach and Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, July 2005

Article 2005-12-05

PDF PDF 65 KB
Shotgunning: Not for Pb-Free - A proper test approach can reduce scrap from random repair methods.
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, November 2005.

Article 2005-12-05

PDF PDF 57 KB
Putting Pb-Free to the Test - Why AOI and SPI are vital to upfront process control and verification.
Written by Stig Oresjo, Thorsten Niermeyer & Stacy Johnson, Agilent Technologies. Article published in Circuits Assembly, May 2005.

Article 2005-12-05

PDF PDF 74 KB
Pb-Free PCB Finishes for ICT - New solders can mean new finishes. How to decide which is best.
Written by Stig Oresjo and Chris Jacobsen, Agilent Technologies. Article published in Circuits Assembly, September 2005.

Article 2005-12-05

PDF PDF 88 KB
Selcom Testimonial
Customer testimonial which discusses the advantages gained from using the Keysight Medalist Family of test and inspection systems.

Case Study 2005-03-14

WMF WMF 19.21 MB
Traceable Calibration for 3070
As test equipment ages, system performance degrades. Agilent can help protect your investment with NIST traceable system calibration.

Feature Story 2004-12-13

Controlling PB-Free Processes Through AOI
Written by Thorsten Niermeyer, Agilent Technologies. Article and cover published in Circuits Assembly, October 2004.

Article 2004-10-01

Pins Test Detects Bondwire Failures
Recently, a high volume 3070 user came across a batch of devices with bad bondwires from the chip vendor. The symptom at ICT was failing "pins" tests (sometimes known as "Chek-Point").

Case Study 2004-05-26

PDF PDF 53 KB
Vectorless Test EP (VTEP) Goes Head-to-Head with Keysight TestJet - Case Study
VTEP has proven its abilities to improve in-circuit test coverage by over 80 percent compared to the older TestJet technology, especially on boards with hard-to-test packages such as BGAs, micro-BGAs, and SMT edge connectors.

Case Study 2003-12-16

PDF PDF 1.36 MB
Selcom Group Uses Integrated Test to Cut Costs and Increase Business
Selcom Group uses a combination of test technologies from Keysight to meet stringent cost, quality, and shipping targets, allowing Selcom to continue growing and thriving in a difficult worldwide economy.

Case Study 2003-10-24

PDF PDF 600 KB
Step-by-Step Series: Step 9 -Test and Inspection
Written by Stig Oresjo, Agilent Technologies. Published in SMT, October 2003.

Article 2003-10-01

Keysight Quality Tool Testimonials
Learn what users have to say about Keysight Quality Tool.

Case Study 2003-09-30

ScanWorks Reduces Vivace Networks' ICT Costs and Improves Board Quality
This paper discusses how Vivace Networks uses ScanWorks at the benchtop and at in-circuit test to reduce test costs and accelerate time to market in a competitive environment.

Case Study 2003-07-31

PDF PDF 29 KB
Lucent Demonstrates how ScanWorks for the Keysight 3070 Can Save Nearly $1 Million Per Year
Lucent has demonstrated that reusing ScanWorks boundary-scan tests on the 3070 ICT platform can produce dramatic cost savings through lower test development and fixture costs without giving up test coverage.

Case Study 2003-07-23

PDF PDF 222 KB
Selecting the Optimal Test Strategy
Written by Stig Oresjo, Agilent Technologies. Published in Circuits Assembly, July 2003.

Article 2003-07-01

Motorola Drives Reliability and Productivity of In-Car Safety Systems with the Keysight 3070
To maintain rigorous testing without hindering assembly line productivity, Motorola chose the Keysight 3070 In-circuit Test System.

Case Study 2003-06-03

PDF PDF 2.01 MB
ScanWorks Completes Successful Assessment at Jabil Circuit
One of the first places electronics manufacturers look to reduce expenses is through the elimination of redundant effort.

Case Study 2003-03-21

PDF PDF 661 KB
AwareTest xi Case Study #1
This case study compares a fully-probed in-circuit test on a conventional high node count test system with a combined x-ray/in-circuit test strategy, using the simplified in-circuit test.

Case Study 2003-02-15

PDF PDF 127 KB
AwareTest xi Case Study #3
This case study compares fault coverage of the current test strategy (automatic optical inspection/full in-circuit test) with a combined x-ray inspection/simplified in-circuit test strategy.

Case Study 2003-02-15

PDF PDF 164 KB
AwareTest xi Case Study #2
This case study compares the current test strategy with a full combined test strategy and a simplified combined test strategy (x-ray inspection followed by simplified in-circuit test).

Case Study 2003-02-15

PDF PDF 763 KB
Advanced Energy Industries, Inc. Adopts 3070 In-Circuit Test with MS Windows OS
The stakes were high, but the upside benefits of PC-based test were hard to ignore. Here's how one company made the move.

Case Study 2002-07-17

PDF PDF 363 KB
Charting a DFT Course for Limited Access Boards
Written by Stig Oresjo and Barry Odbert. Published with permission from SMT Magazine, June 2002.

Article 2002-06-01

PDF PDF 143 KB
Notebook Manufacturer Finds Margins in the Details
Design-for-manufacturing methods and an automated test environment help FIC control costs, improve product quality, and protect its margins.

Case Study 2002-02-07

PDF PDF 457 KB

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