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The Evolution of Vectorless Test
Written by Chris Jacobsen. Published with permission from Circuits Assembly, January 2007.

Article 2007-11-08

PDF PDF 263 KB
Xray Choices for SMT Manufacturing
In many cases, there is a complementary choice of automated 3D X-ray and off-axis 2D X-ray inspection. This article explores this concept. Published with kind permission from SMT

Article 2007-11-01

PDF PDF 188 KB
How to test UMA/GAN-enabled mobile phones
By Jamie Allan and John Russell, Agilent Technologies Published with permissions of Mobile Handset DesignLine

Article 2007-10-29

Evaluating data transfer in HSDPA/W-CDMA nets
Published with permission from Global Sources October 2007

Article 2007-10-15

PDF PDF 2.84 MB
The Utilization of X-ray to Effectively Test Quad Flat No-Lead Packages
Quad Flat No-Lead (QFN) packages are increasingly used on printed circuit boards. The QFN solder joint is hidden from most types of optical inspection test. This paper discusses how X-ray inspection can effectivly detect QFN joint defects.

Article 2007-09-20

PDF PDF 486 KB
Test Strategy Tips and Tricks
Written by Stacy Kalisz Johnson. Published with permission from Circuits Assembly, July 2007.

Article 2007-09-01

PDF PDF 236 KB
Defect-Detection Strategies
Written by James Benson. Published with permission from Circuits Assembly, May 2007.

Article 2007-08-11

PDF PDF 985 KB
Evolving Packages Drive Test and Inspection
Written by Stacy Kalisz Johnson. Published with permission from Circuits Assembly, March 2007

Article 2007-08-11

PDF PDF 747 KB
CAD and Your Test System
Written by Stacy Kalisz Johnson. Published with permission from Circuits Assembly, November 2007.

Article 2007-08-11

PDF PDF 508 KB
Limited Access Testing
Written by Stacy Kalisz Johnson. Published with permission from Circuits Assembly, July 2007.

Article 2007-07-01

PDF PDF 137 KB
The Power of Real-Time and Remote Information
Written by Stacy Kalisz Johnson. Published with permission from Circuits Assembly, May 2007.

Article 2007-05-01

PDF PDF 147 KB
Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing
This is a paper on 01005 Lead-Free Passive Assembly reprinted from IPC

Article 2007-03-01

PDF PDF 759 KB
A Model-Based Automated Debug Process
Learn how Cisco Systems Inc. used Fault Detective on their high-end networking products.

Étude de cas 2007-03-01

PDF PDF 123 KB
A Refresher Course on Windowing and Measurements
In these days of digital instrumentation and PCs, it is easy to forget that physical phenomena are analog and that windows are not always operating systems. Windowing and digitization meet in the process of dynamic signal analysis. This Realtime Update article, Fall 1995 - Winter 1996, Hewlett...

Article 2007-02-22

PDF PDF 90 KB
Order Analysis of Rotating Machinery
This article from Realtime Update, Fall 1996 - Winter 1997, Hewlett-Packard, explains that analyzing the health and behavior of rotating machinery is a key application for dynamic signal analyzers (DSAs). Rotating machines produce repetitive vibrations and acoustic signals related to rotational...

Article 2007-02-22

PDF PDF 538 KB
Coverage Increased on Through-Hole Components Using PTH2 Algorithm
The 5DX Automated X-ray Inspection plated through hole algorithm, PTH2, provides an increase in accuracy along with repeatability for heavily shaded devices.

Bulletin d'information 2006-09-08

Pb-Free PCB Finishes for ICT - New solders can mean new finishes. How to decide which is best.
Written by Stig Oresjo and Chris Jacobsen, Agilent Technologies. Article published in Circuits Assembly, September 2005.

Article 2005-12-05

PDF PDF 88 KB
Overcoming Lower Wetting Forces of Lead-Free Alloys
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, March 2005.

Article 2005-12-05

PDF PDF 77 KB
Shotgunning: Not for Pb-Free - A proper test approach can reduce scrap from random repair methods.
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, November 2005.

Article 2005-12-05

PDF PDF 57 KB
Characterizing new soldering processes – An experimental methodology for process optimization
Written by Glen Leinbach and Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, July 2005

Article 2005-12-05

PDF PDF 65 KB
Putting Pb-Free to the Test - Why AOI and SPI are vital to upfront process control and verification.
Written by Stig Oresjo, Thorsten Niermeyer & Stacy Johnson, Agilent Technologies. Article published in Circuits Assembly, May 2005.

Article 2005-12-05

PDF PDF 74 KB
Pb-Free’s Impacts on Test and Inspection
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, January 2005.

Article 2005-12-05

PDF PDF 75 KB
Fault Detective Case Study #1 Presentation
4 slide presentation that summarizes Keysight employing its test optimization software to improve the quality and yield of its RF printed circuit assemblies.

Étude de cas 2005-09-26

PDF PDF 72 KB
Be generous with tests (Slösa med testerna)
Written by Stig Oresjo, Agilent Technologies. This article discusses the use of AOI for success in lead-free since the lead-free process is less forgiving, than tin-lead. Note that the article is in Swedish.

Article 2005-08-31

VEE Pro Used to Automate Tests of Climactic Chambers
Using VEE Pro, ISSeP (Belgium) developed an automated system to characterize climatic chambers, incubators and refrigeration devices.

Étude de cas 2005-05-09

PDF PDF 238 KB

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