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Recherche par numéro de modèle du produit: Exemples : 34401A, E4440A

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Pb-Free PCB Finishes for ICT - New solders can mean new finishes. How to decide which is best.
Written by Stig Oresjo and Chris Jacobsen, Agilent Technologies. Article published in Circuits Assembly, September 2005.

Article 2005-12-05

PDF PDF 88 KB
Pb-Free’s Impacts on Test and Inspection
Written by Stig Oresjo, Agilent Technologies. Article published in Circuits Assembly, January 2005.

Article 2005-12-05

PDF PDF 75 KB
Fault Detective Case Study #1 Presentation
4 slide presentation that summarizes Keysight employing its test optimization software to improve the quality and yield of its RF printed circuit assemblies.

Étude de cas 2005-09-26

PDF PDF 72 KB
Be generous with tests (Slösa med testerna)
Written by Stig Oresjo, Agilent Technologies. This article discusses the use of AOI for success in lead-free since the lead-free process is less forgiving, than tin-lead. Note that the article is in Swedish.

Article 2005-08-31

VEE Pro Used to Automate Tests of Climactic Chambers
Using VEE Pro, ISSeP (Belgium) developed an automated system to characterize climatic chambers, incubators and refrigeration devices.

Étude de cas 2005-05-09

PDF PDF 238 KB
VEE Pro Used to Characterize Materials
Using an automated test setup written in VEE Pro, ONERA (France) characterizes EM absorption and reflection of space-defense material.

Étude de cas 2005-05-09

PDF PDF 591 KB
End of Support Letters
Good business decisions start with good information, which is why we communicate with customers twice a year about our latest Support Life Policies.

Dossier 2005-04-18

Selcom Testimonial
Customer testimonial which discusses the advantages gained from using the Keysight Medalist Family of test and inspection systems.

Étude de cas 2005-03-14

WMF WMF 19.21 MB
AXI Conquers Hidden Joint Defects
Written by Jeremy Jessen, Agilent Technologies. Published In SMT magazine, February 2005.

Article 2005-02-01

PDF PDF 134 KB
Traceable Calibration for 3070
As test equipment ages, system performance degrades. Agilent can help protect your investment with NIST traceable system calibration.

Dossier 2004-12-13

Solid Shape Modeling - Working Towards 3-D AOI
Written by Xuemei Zhang and Gareth Bradshaw, Agilent Technologies. Published in Surface Mount Technology magazine, November 2004.

Article 2004-11-01

Using AOI to Verify IPC Compliance
Written by Malachy Rice, Ph.D, Agilent Technologies. Appeared in Machine Vision supplement of Test & Measurement World, November 2004.

Article 2004-11-01

Controlling PB-Free Processes Through AOI
Written by Thorsten Niermeyer, Agilent Technologies. Article and cover published in Circuits Assembly, October 2004.

Article 2004-10-01

3D Techniques in SMT Test
By Malachy Rice, Ph.D, Stacy Johnson and Glen Leinbach, Agilent Technologies. Published by EE - Evaluation Engineering, February 2004.

Article 2004-09-28

Utilizing VEE for Data Collection in Surface and Undersea Research
Utilizing VEE for Data Collection in Surface and Undersea Research

Étude de cas 2004-05-27

PDF PDF 130 KB
Pins Test Detects Bondwire Failures
Recently, a high volume 3070 user came across a batch of devices with bad bondwires from the chip vendor. The symptom at ICT was failing "pins" tests (sometimes known as "Chek-Point").

Étude de cas 2004-05-26

PDF PDF 53 KB
Vectorless Test EP (VTEP) Goes Head-to-Head with Keysight TestJet
In beta tests, VTEP proved its abilities to improve in-circuit test coverage by over 80 percent compared to Keysight TestJet, especially on boards with hard-to-test packages such as BGAs, micro-BGAs, and SMT edge connectors.

Étude de cas 2003-12-16

PDF PDF 351 KB
Selcom Group Uses Integrated Test to Cut Costs and Increase Business
Selcom Group uses a combination of test technologies from Keysight to meet stringent cost, quality, and shipping targets, allowing Selcom to continue growing and thriving in a difficult worldwide economy.

Étude de cas 2003-10-24

PDF PDF 600 KB
Step-by-Step Series: Step 9 -Test and Inspection
Written by Stig Oresjo, Agilent Technologies. Published in SMT, October 2003.

Article 2003-10-01

Keysight Quality Tool Testimonials
Learn what users have to say about Keysight Quality Tool.

Étude de cas 2003-09-30

ScanWorks Reduces Vivace Networks' ICT Costs and Improves Board Quality
This paper discusses how Vivace Networks uses ScanWorks at the benchtop and at in-circuit test to reduce test costs and accelerate time to market in a competitive environment.

Étude de cas 2003-07-31

PDF PDF 29 KB
Lucent Demonstrates how ScanWorks for the Keysight 3070 Can Save Nearly $1 Million Per Year
Lucent has demonstrated that reusing ScanWorks boundary-scan tests on the 3070 ICT platform can produce dramatic cost savings through lower test development and fixture costs without giving up test coverage.

Étude de cas 2003-07-23

PDF PDF 222 KB
Selecting the Optimal Test Strategy
Written by Stig Oresjo, Agilent Technologies. Published in Circuits Assembly, July 2003.

Article 2003-07-01

3D Inline SPI
PCB PULSE ARTICLE: Solder paste printing can account for up to 80 percent of all board defects. A new article by Stacy Kalisz Johnson describes how the Agilent SP50 hits that big target at two assembly houses that test fine pitch devices.

Dossier 2003-06-20

Motorola Drives Reliability and Productivity of In-Car Safety Systems with the Keysight 3070
To maintain rigorous testing without hindering assembly line productivity, Motorola chose the Keysight 3070 In-circuit Test System.

Étude de cas 2003-06-03

PDF PDF 2.01 MB

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