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In-Circuit Test Channel Partner Interview Series: Everett Charles Technology
The channel partners series began with an exploration of programming houses. It is not that we venture into the Fixture house side of the business. Please enjoy this extension of the article series.

Feature Story 2009-03-10

PDF PDF 94 KB
In-Circuit Test Channel Partner Interview Series: QXQ, Inc.
This article is continues to educate on fixture houses in relation to in-circuit test as the article series explores fixturing houses that Agilent works regularly with. This article features QXQ, Inc.

Feature Story 2009-03-04

PDF PDF 94 KB
In-Circuit Test Channel Partner Interview Series: TestingHouse Inc.
his article is the fourth in the series of education pieces relating to in-circuit test programming houses that Agilent works regularly with. This article features TestingHouse Inc., from a programming house perspective.

Feature Story 2009-03-03

PDF PDF 95 KB
In-Circuit Test Channel Partner Interview Series: Circuit Check, Inc.
Circuit Check, Inc. provides comment in the editorial series serving to educate our in-circuit test contacts about the variety of fixture houses that Agilent has partnerships with.

Feature Story 2009-02-28

PDF PDF 91 KB
Volumetric Paste Measurement using Solder Paste Inspection (SPI)
Written by : Jeff Bishop, Product Marketing Engineer, Agilent Technologies. The online recording discusses the techniques used for 3D paste analysis, accuracy of the measurements, and how these tools can be integrated into production affectively.

Feature Story 2009-01-20

Is the 5th Harmonic Still Useful for Predicting Data Signal Bandwidth?
This article, published in High Frequency Electronics, compares using the 5th harmonic to using the system rise/fall times to determine the required bandwidth for your system. The article begins on page 18.

Article 2009-01-01

In-Circuit Test Channel Partner Interview Series: Masterpiece Engineering
This article is the third in the series of education pieces relating to in-circuit test programming houses that Agilent works regularly with. This article features Masterpiece Engineering, from a programming house perspective.

Feature Story 2008-12-16

PDF PDF 106 KB
An Overview of WiMAX™ Radiated Performance Test Requirements
Published with kind permission of Communications Today

Article 2008-12-01

PDF PDF 292 KB
Boundary-Scan Testing of Power/Ground Pins
This paper describes how traditional Boundary Scan usage can be expanded to include testing of open defects on power and ground pins. Reprinted with kind permission from IEEE.

Article 2008-11-26

PDF PDF 238 KB
Gathers Thought Leaders in International Bead Probe Technology User Group
by Ted T. Turner, Co-Gen Marketing

Feature Story 2008-11-11

PDF PDF 97 KB
Combine techniques to reduce ICT cost complexity
THis article describes how Cover-Extend Technology combines boundary scan and VTEP vectorless test techniques to help manufacturers reduce costs and complexity in their In-Circuit Test strategy

Article 2008-09-25

In-Circuit Test Channel Partner Interview Series: Everett Charles Technologies (ECT)
This article is the second in the series of education pieces relating to in-circuit test programming houses that Agilent works regularly with. This article features Everett Charles Technologies (ECT), from a programming house perspective.

Feature Story 2008-09-23

PDF PDF 93 KB
In-Circuit Test Channel Partner Interview Series: Solution Sources Programming, Inc.
Agilent’s ICT has been around for decades and has a variety of sponsorship. As a way to provide educational information to our install base, a series of interviews with our programming house partners are in progress. Solution Sources Programming, Inc. is discussed herein.

Feature Story 2008-08-14

PDF PDF 69 KB
Next Generation ICT Solutions for Limited Access Boards
Newer, more complex printed circuit boards are creating new challenges in test accessibility. Published with kind permission of Electronic Manufacturing

Article 2008-05-29

PDF PDF 816 KB
Results from 2007 Industry Defect Level and Test Effectiveness Studies
To select an optimal test strategy, good knowledge of defect levels and test effectiveness are two very important factors to include. This paper presents data from a 2007 study of 3.7 billion solder joints. Reprinted with permission from IPC.

Article 2008-05-21

PDF PDF 118 KB
Article reprint: Implementing Bead Probe Technology for In-Circuit Test:
A major OEM implements bead probe technology on a new design to gain test access and coverage of high-speed circuits. The experiences of a first implementation of bead probe technology are discussed here.

Article 2008-03-06

PDF PDF 1.88 MB
Article reprint: Impact of Quad Flat No Lead Package (QFN) on Automated X-ray Inspection (AXI)
This paper discusses lack of industry specification for QFN inspection, how AXI methodology was improved to detect QFN solder joint defect, design for inspection and future work.

Article 2008-03-06

PDF PDF 1.63 MB
Article reprint: Finding Power/Ground Defects on Connectors A New Approach
This paper surveys existing tests for these defects and introduces a new solution based on Network Parameter Measurements

Article 2008-03-06

PDF PDF 199 KB
Article reprint: A Bead Probe CAD Strategy for In-Circuit Test
This paper discusses the potential of using Bead Probes in Computer Aided Design (CAD) systems when getting a board ready for production.

Article 2008-03-06

PDF PDF 606 KB
Testing HSUPA devices
By: Jeanne Fightmaster, Agilent Technologies Published with permissions of EETimes Asia

Article 2007-11-16

PDF PDF 404 KB
The Evolution of Vectorless Test
Written by Chris Jacobsen. Published with permission from Circuits Assembly, January 2007.

Article 2007-11-08

PDF PDF 263 KB
Xray Choices for SMT Manufacturing
In many cases, there is a complementary choice of automated 3D X-ray and off-axis 2D X-ray inspection. This article explores this concept. Published with kind permission from SMT

Article 2007-11-01

PDF PDF 188 KB
How to test UMA/GAN-enabled mobile phones
By Jamie Allan and John Russell, Agilent Technologies Published with permissions of Mobile Handset DesignLine

Article 2007-10-29

Evaluating data transfer in HSDPA/W-CDMA nets
Published with permission from Global Sources October 2007

Article 2007-10-15

PDF PDF 2.84 MB
The Utilization of X-ray to Effectively Test Quad Flat No-Lead Packages
Quad Flat No-Lead (QFN) packages are increasingly used on printed circuit boards. The QFN solder joint is hidden from most types of optical inspection test. This paper discusses how X-ray inspection can effectivly detect QFN joint defects.

Article 2007-09-20

PDF PDF 486 KB

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