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High-Speed Data Throughput Test
Ensure a quality user experience by fully testing the packet data performance of your wireless device early in the design cycle. The 8960 offers the highest 2G/3G/3.5G data rates and real-world testing to find issues sooner and resolve them faster!

Feature Story 2011-11-29

Defect Coverage of Boundary-Scan Tests - Article Reprint
This paper discusses the potential and challenges with some defects when using the "PCOLA/SOQ" metric model in boundary scan test coverage.

Article 2011-11-04

PDF PDF 245 KB
Test Coverage: What Does It Mean when a Board Test Passes? - Article Reprint
Defining board test coverage as a percentage of devices or nodes having tests does not accurately portray coverage. This paper explores an alternative 'defect universe' to better depict test coverage.

Article 2011-10-27

PDF PDF 89 KB
A New Probing Technique for High-Speed/High-Density Printed Circuit Boards - Article Reprint
This paper discusses how in-circuit test access can be maintained, even on highly dense gigabit logic boards.

Article 2011-10-24

PDF PDF 341 KB
ICT Boundary Scan Development Steps - Article Reprint
This paper discusses how test point access and good data can make a big difference in the success of your boundary scan test. Best practises for boundary scan test development are also highlighted.

Article 2011-08-08

PDF PDF 411 KB
A Primer on Test Options - Article Reprint
This paper discusses why ICT remains the best option for high-volume electronics manufacturing, with its flexibility to provide a myriad of test options to meet different manufacturing needs.

Article 2011-08-08

PDF PDF 269 KB
LED Measurement Options at ICT - Article Reprint
This paper reviews current methods and constraints of LED color testing methodologies.

Article 2011-08-08

PDF PDF 306 KB
Successful ICT Boundary Scan Implementation - Article Reprint
This paper details eight steps which can help you get the best possible boundary scan test coverage with your i3070 in-circuit tester.

Article 2011-08-08

PDF PDF 111 KB
In-Circuit Tester - N5747A High-Power Power Supply - Case Study
This paper discusses the first successful implementation of the Keysight N5747A high-power power supply on a customer product - a networking board project.

Case Study 2011-02-11

PDF PDF 1.12 MB
Latin America: Pushing the Boundaries of Test-Article Reprint
A first-hand stock taking of the EMS scene in Brazil and Mexico from an engineer's road trip.

Article 2011-01-13

PDF PDF 966 KB
Programming In-System versus Offline-Article Reprint
Is offline programming or ISP at in-circuit test better? One key consideration is the cost of each method. This paper looks at pros and cons of these two methods contributing to the overall costing.

Article 2011-01-13

PDF PDF 159 KB
Surviving State Disruptions Caused by Test: the "Lobotomy Problem"
This paper examines some issues and trends that justify adding features to IEEE 1149.1 that will facilitate safe, fast and effective initialization of a board or system, to get it ready for testing. Published with kind permission of the IEEE

Article 2010-12-10

PDF PDF 402 KB
Solutions for Undetected Shorts on IEEE 1149.1 Self-Monitoring Pins
This paper presents the problem of undetected shorts on IEEE 1149.1 compliant self-monitoring pins, and potential mitigating solutions.

Article 2010-12-10

PDF PDF 789 KB
Limited Access Tools Improve Test Coverage - Article Reprint
Smaller test pads and shrinking board sizes are posing new challenges, and driving innovations to overcome limited access with new test solutions. Agilent Boundary Scan, 1149.6, 1149.1, bead probes, cover-extend

Article 2010-10-20

PDF PDF 275 KB
The Proposed IEEE Test Standards - Article Reprint
There is a resurgence of interest in Boundary Scan and Built in Self Test (BIST) initiatives to be part of IEEE standards. This article explains the IEEE standard and their benefits to the industry. Agilent Boundary Scan, 1149.6, 1149.1, bead probes, cover-extend

Article 2010-10-20

PDF PDF 2.83 MB
A New Equilibrium - Article Reprint
The EMS and ODM markets are moving to a new equilibrium as they continue to balance cost pressures and technology evolution. This article looks at the trends shaping this new balance.

Article 2010-10-20

PDF PDF 192 KB
8PSK Modulation Accuracy Measurement Graphics

Feature Story 2010-10-12

Access Secured Information on our Agilent.com Customer Website
In this issue, we would like to start by providing information for you to access the reserved resources we have on the Agilent Customer website, which is accessible only to our support agreement customers.

Newsletter 2010-09-19

Real-World Battery Drain Analysis
Go beyond Talk Time Test! Test the battery life of your data device using realistic user scenarios to ensure real-world operation meets user expectations with the 8960, 14565B and IFT software.

Feature Story 2010-08-30

Throughput comparison for Medalist i3070 Series 5 and i3070 In-Circuit Test
The new Medalist i3070 Series 5 in-circuit tester has several new features which enable manufacturers to speed up their tests, when compared with using the older i3070 series.

Case Study 2010-08-11

PDF PDF 175 KB
Flash Programming - Keysight Utility Card versus Deep Serial Memory Case Study
This case study compares flash programming performances of the Keysight Medalist i3070 Series 5 in-circuit tester (ICT) with utility card flash programming solution against the Teradyne ICT solution.

Case Study 2010-07-07

PDF PDF 155 KB
Flash programming with the Keysight Utility Card - Successful Implementation
This case study details the successful implementation of flash programming with the Keysight utility card in the manufacturing environment.

Case Study 2010-06-28

PDF PDF 144 KB
Microwave Engineering Europe X-parameters Article

Article 2010-06-02

Access Entitled Content on our Agilent.com Customer Website
Customers who have active warranty or support agreement for their ICT, AXI or AOI test system can register for access to Printed Circuit Assembly Board Test and Inspection entitled content.

Newsletter 2010-05-31

VEE Case Studies
VEE Case Studies

Case Study 2010-05-20

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