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Overcome LTE-A and 802.11ac Manufacturing Test Challenges with Keysight's new EXM Webcast

1   Hour | Webcast - recorded | Where & When

WHY THIS WEBCAST IS IMPORTANT

Manufacturing wireless devices and chipsets at the lowest possible cost has become increasingly challenging as the number and complexity of wireless technologies has increased. Competitive pressure has dictated that manufacturers find new methods for producing products that reduce the cost of test while ensuring the quality of their products. Another challenge is to quickly get products into volume production that potentially uses chipsets from a number of different companies.

At the end of the webcast, participants will understand:
• New techniques that wireless device manufactures are using to increase production throughput.
• How the next generation of test sets overcome demands to efficiently test all cellular technologies, WLAN, Bluetooth, GPS and digital video.
• How test-instrument integration with chipset control is essential for effective manufacturing.

WHO SHOULD ATTEND

Engineers and technicians involved in the manufacturing and test of wireless devices, including smartphones, tablets, access points, client modules, as well as chipsets that are used in these devices.

PRESENTER

Jim McCord, Product Marketing Engineer for Wireless Manufacturing Test Sets, Agilent Technologies

Jim McCord is a Product Marketing Engineer for Agilent Technologies. He is focused on high-throughput wireless device manufacturing test. Jim has held a variety of positions in application engineering, management, and product marketing in his more than 30 years at Hewlett-Packard and Agilent Technologies.

Where & When

Price Location For more information
Free At Your PC Enroll to view the March 26, 2014 recorded broadcast 

Prices shown are list prices and are subject to change without notice.

Training & Event Materials

Overcome LTE-A and 802.11ac Manufacturing Test Challenges with Agilent’s new EXM Webcast Slides 
Slides from the March 26, 2014 webcast

Seminar Materials 2014-03-26

PDF PDF 1.79 MB