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Innovations in EDA: Accurate Modeling of Packages and Interconnects Webcast

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An important step in high frequency / high speed IC design is the characterization of IC performance within a realistic environment including packaging, interconnects, connectors, etc. There are several approaches to creating accurate models of these elements, such as creating equivalent circuit models, EM simulations, and measurements. This webcast will compare these different methods and examine the trade-offs of each. Several case studies are presented which compare measured and simulated results.

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Accurate Modeling of Packages and Interconnects 
Innovations in EDA Webcast Series presented on December 2, 2010.

세미나 프리젠테이션 2010-12-02

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