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Digital Design & Interconnect Standards

In digital standards, every generational change puts new risks in your path. We see it first hand when creating our products and working with engineers like you. Keysight’s solution set for high-speed digital test is a combination of instrumentation and broad expertise built on our ongoing involvement with industry experts. By sharing our latest experiences, we can help anticipate challenges and accelerate your ability to create products you’ll be proud of.

Keysight - Insights for your best design

Learn more about Digital Design & Interconnect solutions from Keysight. 

Keysight RF and Digital Learning Center - A commitment to learning with industry experts 
 

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Which EM Solver Should I Use? 
Originally broadcast June 15, 2010

Webcast - recorded

 
Innovations in EDA: Multi-Technology RF Design Using the New Advances in ADS 2011 
Originally broadcast March 1, 2011

Webcast - recorded

 
Innovations in EM Simulation for High Speed Digital Design 
Original broadcast Nov 18, 2010; Part of the Series: Signal Integrity for High Speed Digital Interconnects.

Webcast - recorded

 
Using IBIS AMI Models as ‘Executable Data sheets’ in High Speed Digital Interconnect Simulations 
Originally broadcast Sept 9, 2010. Part of the Series: Signal Integrity for High Speed Digital Interconnects.

Webcast - recorded

 
Signal Integrity: Include Post-layout PCB Artwork into your Eye Diagram and BER Contour Simulation 
Originally broadcast May 5, 2010. Part of the Series: Signal Integrity for High Speed Digital Interconnects.

Webcast - recorded

 
Successful High-Speed Digital Design for PC board using ADS 
A hands-on workshop on how to solve increasingly difficult signal integrity and power integrity challenges using Advanced Design System.

Seminar Materials 2014-02-27

 
ADS in 3D: Speed Your Design with Integrated 3D EM Simulation 
Originally broadcast March 24, 2010

Webcast - recorded

 
Vector Modulation and Frequency Conversion Fundamentals Webcast 
Original broadcast July 18, 2013

Webcast - recorded

 
Physical Layer design challenges for PCI Express® 3.0 and 2.0 designs 
You will learn advanced techniques for PCI Express phy-layer validation covering the latest PCIe 3.0 specification requirements as well as practical extensions to PCIe 2.0 and 1.1 designs. This seminar analyzes transmitter and receiver performance.

Webcast - recorded

 
Overcome High Speed Digital Design Challenges Webcast Series 
Series of live and on-demand webcasts

Webcast - recorded

 
Basics of RF Amplifier Test With the Vector Network Analyzer 
Original broadcast Mar 13, 2012

Webcast - recorded

 
Solving New High-Speed Design Challenges with ADS 2013.06 
In this seminar, leading Keysight R&D Designers provide a first-hand look at the new HSD features for the world class Advanced Design System (ADS) transient and channel convolution simulators.

Seminar Materials 2013-07-10

 
Overcome PI Challenges on Perforated Power/Groung Planes 
This presentation explains a different approach that's applicable to PI analysis on cost reduced consumer boards whose power/ground planes are perforated with signal traces.

Seminar Materials 2012-01-19

PDF PDF 2.30 MB
Overcome Signal Integrity Challenges in the multigigabit(s) Era 
When digital signals reach gigabit/s speeds, the unpredictable becomes the norm. The process of getting your project back on track starts with the best tools for the job.

Seminar Materials 2011-12-15

PDF PDF 781 KB
Design and Test Challenges in Next Generation High-Speed Serial Standards 
Attend this FREE education workshop at DesignCon 2012, brought to you by Agilent Technologies, Official Host Sponsor of the conference.

Training Materials 2011-11-29

 
View the recorded webcast - How to handle USB 3.0 physical layer test requirements 
How to handle USB 3.0 physical layer test requirements.

Training Materials 2011-11-08

 
Overcoming Return-Path-Discontinuity in DDR3 and GDDR5 Memory-Controller Packages 
A day in the life of a Memory Architect.

Seminar Materials 2011-10-24

PDF PDF 1.86 MB
Enabling MIPI Physical Layer Test- High Speed and Characterization 

Seminar Materials 2011-10-04

 
Successful High Speed Digital Design with ADS, EMPro, and SystemVue 
The materials in this self-guided workshop will show you the latest high speed digital capabilites in ADS 2011.

Seminar Materials 2011-09-29

 
Signal Integrity Design Using Channel Simulation and EM Co-design 
The materials in this self-guided workshop will show you the “what if” design space exploration workflow that our new statistical eye diagram channel simulator enables

Seminar Materials 2010-04-21

 
Tips to Debugging DDR 1, 2 and 3 Physical and Protocol Layer Issues webcast 

Training Materials 2009-01-06

 
ADMF: Facing the challenges of Super speed USB 3.0 Product Development  
Agilent Digital Measurement Forum (ADMF): Facing the challenges of Super speed USB Product Development

Seminar Materials 2008-11-12

PDF PDF 1.78 MB
Digitizing Oscilloscope Fundamentals 
This class gives the student an in-depth understanding of the operation and measurement techniques with an Infiniium oscilloscope.

Classroom Training

 

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