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RF System-in-Package & RF Module Design

RF System-in-Package DesignThe trend in the wireless industry toward smaller form factor and more functionality has been driving technology innovations for continued increase in functional density and a decrease in the cost per function. SiP, SoP, and 3DIC technologies are rapidly evolving from a specialty technology used in a narrow set of applications, to a high volume technology that addresses current market and design challenges. However the complex design problems with mixed signal, mixed mode, multi-technology, increased interconnect density and closer design proximity has also increased design challenges to meet design requirements faster and at a lower cost.

Keysight EEsof EDA is the market and technology leader in RF SiP & RF Module design solutions offering:

  • The best methodologies for designing SiPs with high confidence
  • The best RF SiP co-design platform
  • The best way to reduce design failure risks due to unpredicted parasitics

RF SiP/Module Technology Overview

RF SiP/Module Design Value

RF SiP/Module Design Flows